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SN74BCT374DBR

Texas Instruments

SN74BCT374DBR by Texas Instruments

SN74BCT374DBR by Texas Instruments is an 8-bit bus driver with a propagation delay of 10.6 ns at 5V, suitable for applications requiring true output polarity and positive edge triggering. This small outline IC features a max operating temperature of 70°C, dual terminal position, and a Gull Wing form factor for surface mounting in commercial-grade environments.

Median Price

$3.238

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 1,999 parts In-Stock

1+ parts

$3.730

100+ parts

$2.710

1k+ parts

-

10k+ parts

-

1,999

$3.730

$2.710

-

-

Rochester

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

$2.660

1k+ parts

$2.380

10k+ parts

$2.240

4,000

-

$2.660

$2.380

$2.240

DigiKey

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

$3.500

1k+ parts

-

10k+ parts

-

4,000

-

$3.500

-

-

Verical

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.975

10k+ parts

$2.800

4,000

-

-

$2.975

$2.800

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,221 parts In-Stock

1+ parts

$2.802

100+ parts

-

1k+ parts

-

10k+ parts

-

4,221

$2.802

-

-

-

DigiKey Marketplace

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,000

-

-

-

-

Vyrian

USA . 2,537 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,537

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,390 parts In-Stock

1+ parts

$2.655

100+ parts

-

1k+ parts

-

10k+ parts

-

4,390

$2.655

-

-

-

Andel Nordic

Denmark . 811 parts In-Stock

1+ parts

$9.004

100+ parts

-

1k+ parts

$8.644

10k+ parts

$8.644

811

$9.004

-

$8.644

$8.644

Parana Technologies

USA . 1,847 parts In-Stock

1+ parts

$27.292

100+ parts

-

1k+ parts

$34.236

10k+ parts

-

1,847

$27.292

-

$34.236

-

DigiPath Technology Company

USA . 159 parts In-Stock

1+ parts

$30.052

100+ parts

$27.648

1k+ parts

-

10k+ parts

-

159

$30.052

$27.648

-

-

ChromeModa Solutions

Germany . 3,999 parts In-Stock

1+ parts

$30.665

100+ parts

$25.145

1k+ parts

-

10k+ parts

-

3,999

$30.665

$25.145

-

-

IDEA Electronic Components Group

UK . 361 parts In-Stock

1+ parts

$30.665

100+ parts

$29.132

1k+ parts

$27.598

10k+ parts

-

361

$30.665

$29.132

$27.598

-

Microchip USA

USA . 11,148 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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11,148

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-

-

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QUARKTWIN TECHNOLOGY LTD

USA . 4,466 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,466

-

-

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Overview

Enhance your electronic projects with the SN74BCT374DBR from Texas Instruments, a top-tier manufacturer known for producing high-quality components. This Bus Driver & Transceiver offers reliable performance, versatile applications, and seamless integration. With a compact design and advanced technology, this product provides exceptional value and benefits to customers seeking efficiency and precision in their designs. Upgrade your projects today with the SN74BCT374DBR and experience the difference Texas Instruments brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the transceiver, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 10.6 ns

Low propagation delay ensures fast signal transmission, making this transceiver suitable for applications requiring quick response times.

Surface Mount: YES

Surface mount capability makes installation easier and more efficient for manufacturers.

Nominal Supply Voltage / Vsup (V): 5

Operating at a common 5V supply voltage simplifies the design and integration of this transceiver into various systems.

Maximum I (ol): 64 Amp

High output current capability allows this transceiver to drive heavy loads with ease.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures reliable operation within standard temperature ranges, making this transceiver suitable for general commercial applications.

Technology: BICMOS

Utilizing Bipolar CMOS (BICMOS) technology combines the advantages of both bipolar and CMOS technologies, offering high-speed performance with low power consumption.

Technical Specifications

Bus Driver & Transceivers SN74BCT374DBR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

BCT/FBT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

7.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP20(UNSPEC)

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

60 mA

Propagation Delay At Nominal Supply:

10.6 ns

Propagation Delay (tpd):

10.6 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

5.3 mm

Trade Compliance

SN74BCT374DBR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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