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SN74BCT373NSR

Texas Instruments

SN74BCT373NSR by Texas Instruments

SN74BCT373NSR by Texas Instruments is an 8-bit bus driver with a propagation delay of 9.5 ns at 5V, suitable for commercial applications. It features a 3-STATE output, operates b/w 0-70°C, and has a small outline package style for surface mount assembly.

Median Price

$15.291

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$15.291

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-

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10

$15.291

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Vyrian

USA . 7,871 parts In-Stock

1+ parts

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7,871

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Digiode

USA . 2,514 parts In-Stock

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2,514

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 2,092 parts In-Stock

1+ parts

$1.785

100+ parts

-

1k+ parts

$1.714

10k+ parts

$1.714

2,092

$1.785

-

$1.714

$1.714

AZTECH Wire

Italy . 878 parts In-Stock

1+ parts

$8.347

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878

$8.347

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Parana Technologies

USA . 2,020 parts In-Stock

1+ parts

$18.188

100+ parts

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$18.325

10k+ parts

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2,020

$18.188

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$18.325

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DigiPath Technology Company

USA . 1,892 parts In-Stock

1+ parts

$20.027

100+ parts

$18.425

1k+ parts

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1,892

$20.027

$18.425

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ChromeModa Solutions

Germany . 5,024 parts In-Stock

1+ parts

$20.436

100+ parts

$16.758

1k+ parts

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5,024

$20.436

$16.758

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IDEA Electronic Components Group

UK . 1,349 parts In-Stock

1+ parts

$20.436

100+ parts

$19.414

1k+ parts

$18.392

10k+ parts

-

1,349

$20.436

$19.414

$18.392

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One Stop Electronics

USA . 1,428 parts In-Stock

1+ parts

$51.000

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1,428

$51.000

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Component Stockers USA

USA . 389 parts In-Stock

1+ parts

$99.990

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389

$99.990

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A-Z Elektronik GmbH

Germany . 5,618 parts In-Stock

1+ parts

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5,618

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Microchip USA

USA . 4,201 parts In-Stock

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Corphita

USA . 4,002 parts In-Stock

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Kepictronics

USA . 500 parts In-Stock

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500

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Overview

Upgrade your electronics with the SN74BCT373NSR by Texas Instruments, a high-quality Bus Driver & Transceiver that offers unmatched performance and reliability. Texas Instruments is a renowned manufacturer known for its cutting-edge technology and innovative solutions. This versatile component is perfect for applications requiring efficient data transmission and control of multiple devices. With a small outline package and 3-STATE output characteristics, this product provides customers with value, benefits, and advantages that exceed expectations. Experience seamless integration and superior functionality with the SN74BCT373NSR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product ideal for use in various environments without adding unnecessary weight.

Propagation Delay At Nominal Supply: 9.5 ns

Low propagation delay ensures fast and efficient signal transmission, reducing the overall response time of the system.

Surface Mount: YES

Surface mount technology allows for easy and convenient installation on PCBs, saving space and reducing assembly time.

No. of Bits: 8

Having 8 bits allows for a wide range of data transmission and processing capabilities, making the product versatile for different applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage ensures compatibility with most systems and makes integration hassle-free.

Maximum I (ol): 64 Amp

High output current capability of 64 Amps allows the product to drive larger loads, making it suitable for demanding applications.

Maximum Operating Temperature: 70 °C

With a high operating temperature range of 70°C, the product can operate reliably in harsh environmental conditions without overheating.

Minimum Operating Temperature: 0 °C

The ability to operate at as low as 0°C ensures the product can function in a wide range of temperature conditions, increasing its versatility.

Technology: BICMOS

Utilizing BICMOS technology combines the advantages of both bipolar and CMOS technologies, providing high-speed operation and low power consumption.

Technical Specifications

Bus Driver & Transceivers SN74BCT373NSR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Family:

BCT/FBT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.6 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

9.5 ns

Propagation Delay (tpd):

9.3 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.3 mm

Trade Compliance

SN74BCT373NSR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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