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SN74AVCH24T245ZRGR

Texas Instruments

SN74AVCH24T245ZRGR by Texas Instruments

SN74AVCH24T245ZRGR by Texas Instruments is a 6-function bus driver with 4 bits, operating at 1.5V/3.3V translation levels and supporting up to 12A output current. It features a propagation delay of 6.2ns, operates in industrial temperature range (-40°C to 85°C), and comes in a grid array package suitable for surface mount applications.

Median Price

$2.034

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 5,419 parts In-Stock

1+ parts

$1.670

100+ parts

$1.640

1k+ parts

$1.600

10k+ parts

-

5,419

$1.670

$1.640

$1.600

-

DigiKey

USA . 45 parts In-Stock

1+ parts

$4.320

100+ parts

$2.866

1k+ parts

-

10k+ parts

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45

$4.320

$2.866

-

-

Avnet

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.034

10k+ parts

$1.759

1,000

-

-

$2.034

$1.759

Distributors (In-Stock)

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Digiode

USA . 4,140 parts In-Stock

1+ parts

$4.104

100+ parts

-

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4,140

$4.104

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Vyrian

USA . 8,028 parts In-Stock

1+ parts

-

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8,028

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Prism Electronics

USA . 1 parts In-Stock

1+ parts

-

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-

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1

-

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Distributors (Availability)

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Andel Nordic

Denmark . 3,445 parts In-Stock

1+ parts

$3.150

100+ parts

-

1k+ parts

$3.024

10k+ parts

$3.024

3,445

$3.150

-

$3.024

$3.024

Corphita

USA . 4,539 parts In-Stock

1+ parts

$3.888

100+ parts

-

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10k+ parts

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4,539

$3.888

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-

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Parana Technologies

USA . 1,620 parts In-Stock

1+ parts

$11.033

100+ parts

-

1k+ parts

$11.494

10k+ parts

-

1,620

$11.033

-

$11.494

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ChromeModa Solutions

Germany . 3,857 parts In-Stock

1+ parts

$12.397

100+ parts

$10.166

1k+ parts

-

10k+ parts

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3,857

$12.397

$10.166

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IDEA Electronic Components Group

UK . 558 parts In-Stock

1+ parts

$12.397

100+ parts

$11.777

1k+ parts

$11.157

10k+ parts

-

558

$12.397

$11.777

$11.157

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Lixinc

USA . 10,916 parts In-Stock

1+ parts

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10,916

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Perfect Parts

USA . 1,583 parts In-Stock

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1,583

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DigiPath Technology Company

USA . 1,310 parts In-Stock

1+ parts

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100+ parts

$11.177

1k+ parts

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1,310

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$11.177

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Assy Fe

Spain . 1,000 parts In-Stock

1+ parts

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1,000

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Kepictronics

USA . 570 parts In-Stock

1+ parts

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570

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Microchip USA

USA . 260 parts In-Stock

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260

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Overview

Unlock seamless data transmission and enhanced connectivity with the Texas Instruments SN74AVCH24T245ZRGR Bus Driver & Transceivers. Crafted with precision and expertise, this product boasts top-notch quality and reliability that Texas Instruments is renowned for. Ideal for a wide range of applications, this product offers unparalleled value, efficiency, and performance to customers. Experience effortless integration and optimal functionality with the SN74AVCH24T245ZRGR, setting new standards in bus driver technology. Elevate your projects with this cutting-edge solution from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for use in various applications without adding unnecessary weight.

Propagation Delay At Nominal Supply: 6.2 ns

The low propagation delay ensures fast and efficient communication between components, enhancing overall system performance.

Surface Mount: YES

The surface mount capability allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

No. of Functions: 6

Having multiple functions integrated into one component reduces the need for additional components, saving space and cost in the system design.

Package Shape: RECTANGULAR

The rectangular shape is a standard form factor that fits well in most circuit designs, ensuring compatibility and ease of integration.

No. of Bits: 4

The 4 bits configuration provides sufficient data transmission capacity for many applications, making it versatile and suitable for various use cases.

Translation: 1.5/3.3V&1.5/3.3V

The ability to support multiple voltage translations allows for compatibility with different systems and devices, enhancing the product's versatility.

Nominal Supply Voltage / Vsup (V): 1.5

The low nominal supply voltage of 1.5V reduces power consumption and heat dissipation, contributing to energy efficiency.

Load Capacitance (CL): 15 pF

The specified load capacitance of 15 pF ensures stable and reliable signal transmission, minimizing signal distortion and interference.

Power Supplies (V): 1.5/3.3

The provision for dual power supplies at 1.5V and 3.3V offers flexibility in system design and compatibility with various power sources.

No. of Terminals: 83

With 83 terminals, this product provides ample connectivity options for interfacing with other components and peripherals in the system.

Maximum I (ol): 12 Amp

The high maximum output current of 12 Amps allows for driving a wide range of loads, making it suitable for demanding applications.

Output Characteristics: 3-STATE

The 3-state output feature allows for high impedance state, enabling multiple drivers to share a common bus without interference, enhancing system flexibility.

Minimum Operating Temperature: -40 °C

The wide minimum operating temperature range of -40°C ensures reliable operation in harsh environmental conditions, making it suitable for industrial applications.

Technology: CMOS

Being based on CMOS technology, the product offers low power consumption, high noise immunity, and compatibility with a wide range of systems.

Maximum Supply Voltage (Vsup): 3.6 V

The maximum supply voltage of 3.6V provides a safety margin against voltage spikes, ensuring the device's robustness and reliability in varying operating conditions.

Technical Specifications

Bus Driver & Transceivers SN74AVCH24T245ZRGR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

AVC

JESD-30 Code:

R-PBGA-B83

JESD-609 Code:

e1

Length:

10 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

6

No. of Ports:

2

No. of Terminals:

83

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA83,6X14,25

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.5/3.3

Maximum Power Supply Current (ICC):

.075 mA

Propagation Delay At Nominal Supply:

6.2 ns

Propagation Delay (tpd):

6.2 ns

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage / Vsup (V):

1.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

1.5/3.3V&1.5/3.3V

Width:

4.5 mm

Trade Compliance

SN74AVCH24T245ZRGR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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