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SN74AVCB324245KR

Texas Instruments

SN74AVCB324245KR by Texas Instruments

SN74AVCB324245KR by Texas Instruments is a 8-bit bus driver with 4 functions, featuring a propagation delay of 3.1 ns and operating temperature range of -40 to 85 °C. Ideal for industrial applications requiring bidirectional control, it has a low profile grid array package with surface mount capability.

Median Price

$5.108

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 16,916 parts In-Stock

1+ parts

-

100+ parts

$4.540

1k+ parts

$4.060

10k+ parts

$3.820

16,916

-

$4.540

$4.060

$3.820

Verical

USA . 10,626 parts In-Stock

1+ parts

-

100+ parts

$5.675

1k+ parts

$5.075

10k+ parts

$4.775

10,626

-

$5.675

$5.075

$4.775

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,366 parts In-Stock

1+ parts

$4.788

100+ parts

-

1k+ parts

-

10k+ parts

-

2,366

$4.788

-

-

-

Vyrian

USA . 8,919 parts In-Stock

1+ parts

-

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-

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-

10k+ parts

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8,919

-

-

-

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Chip Stock

USA . 2,515 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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2,515

-

-

-

-

Netsource Technology, Inc.

USA . 875 parts In-Stock

1+ parts

-

100+ parts

-

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875

-

-

-

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Sea View Technologies

USA . 520 parts In-Stock

1+ parts

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-

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520

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Bristol Electronics

USA . 520 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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520

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 118 parts In-Stock

1+ parts

$3.039

100+ parts

-

1k+ parts

$2.917

10k+ parts

$2.917

118

$3.039

-

$2.917

$2.917

Corphita

USA . 4,154 parts In-Stock

1+ parts

$4.536

100+ parts

-

1k+ parts

-

10k+ parts

-

4,154

$4.536

-

-

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Parana Technologies

USA . 2,083 parts In-Stock

1+ parts

$27.699

100+ parts

-

1k+ parts

$38.913

10k+ parts

-

2,083

$27.699

-

$38.913

-

DigiPath Technology Company

USA . 2,264 parts In-Stock

1+ parts

$30.501

100+ parts

-

1k+ parts

-

10k+ parts

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2,264

$30.501

-

-

-

ChromeModa Solutions

Germany . 6,252 parts In-Stock

1+ parts

$31.123

100+ parts

$25.521

1k+ parts

-

10k+ parts

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6,252

$31.123

$25.521

-

-

IDEA Electronic Components Group

UK . 62 parts In-Stock

1+ parts

$31.123

100+ parts

$29.567

1k+ parts

$28.011

10k+ parts

-

62

$31.123

$29.567

$28.011

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Microchip USA

USA . 457 parts In-Stock

1+ parts

-

100+ parts

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457

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Overview

Experience unparalleled reliability and efficiency with the Texas Instruments SN74AVCB324245KR Bus Driver & Transceivers. Designed with precision and innovation, this product offers seamless performance in various applications. With a focus on quality and value, Texas Instruments ensures that customers receive top-notch products that provide enhanced functionality and ease of use. Trust in the expertise and reputation of Texas Instruments to deliver superior solutions for your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the bus driver and transceiver, ensuring a longer lifespan for the product.

Propagation Delay At Nominal Supply: 3.1 ns

Low propagation delay ensures fast signal transmission, making this product suitable for high-speed data communication applications.

Surface Mount: YES

Surface mount packaging allows for easy and efficient installation on PCBs, saving space and simplifying the manufacturing process.

No. of Functions: 4

Having multiple functions in a single component can help reduce the overall number of components in a design, leading to cost savings and improved reliability.

Nominal Supply Voltage / Vsup (V): 1.5

Operating at a low supply voltage can help minimize power consumption and heat generation, making the product more energy-efficient.

Load Capacitance (CL): 30 pF

The specified load capacitance ensures compatibility with a wide range of devices and helps maintain signal integrity during transmission.

Output Characteristics: 3-STATE

The 3-STATE output allows for flexible control of the bus driver and transceiver, enabling high impedance states when the output is not actively transmitting data.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product suitable for battery-powered devices and noise-sensitive environments.

Technical Specifications

Bus Driver & Transceivers SN74AVCB324245KR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

AVC

JESD-30 Code:

R-PBGA-B96

JESD-609 Code:

e0

Length:

13.5 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

2

No. of Bits:

8

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

96

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA96,6X16,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

235

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.16 mA

Propagation Delay At Nominal Supply:

3.1 ns

Propagation Delay (tpd):

6.8 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.4 V

Nominal Supply Voltage / Vsup (V):

1.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Translation:

N/A

Width:

5.5 mm

Trade Compliance

SN74AVCB324245KR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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