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SN74AVC32T245GKER

Texas Instruments

SN74AVC32T245GKER by Texas Instruments

Texas Instruments SN74AVC32T245GKER is a 96-terminal bus driver with 4 functions, offering bidirectional control and true output polarity. It operates at a supply voltage of 1.5/3.3V, with a propagation delay of 6.2ns and max operating temperature of 85°C. Ideal for industrial applications requiring low-profile, fine-pitch components in grid array packaging.

Median Price

$2.510

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 12,720 parts In-Stock

1+ parts

$2.510

100+ parts

$2.460

1k+ parts

$2.410

10k+ parts

-

12,720

$2.510

$2.460

$2.410

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,924 parts In-Stock

1+ parts

$2.384

100+ parts

-

1k+ parts

-

10k+ parts

-

2,924

$2.384

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-

-

Vyrian

USA . 8,791 parts In-Stock

1+ parts

-

100+ parts

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-

10k+ parts

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8,791

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Chip Stock

USA . 3,511 parts In-Stock

1+ parts

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100+ parts

-

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3,511

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 1,699 parts In-Stock

1+ parts

$1.600

100+ parts

-

1k+ parts

$1.536

10k+ parts

$1.536

1,699

$1.600

-

$1.536

$1.536

Corphita

USA . 337 parts In-Stock

1+ parts

$2.259

100+ parts

-

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10k+ parts

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337

$2.259

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AZTECH Wire

Italy . 1,171 parts In-Stock

1+ parts

$20.910

100+ parts

-

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1,171

$20.910

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-

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Parana Technologies

USA . 1,924 parts In-Stock

1+ parts

$21.051

100+ parts

-

1k+ parts

$21.295

10k+ parts

-

1,924

$21.051

-

$21.295

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DigiPath Technology Company

USA . 991 parts In-Stock

1+ parts

$23.180

100+ parts

-

1k+ parts

-

10k+ parts

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991

$23.180

-

-

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ChromeModa Solutions

Germany . 4,879 parts In-Stock

1+ parts

$23.653

100+ parts

$19.395

1k+ parts

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10k+ parts

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4,879

$23.653

$19.395

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IDEA Electronic Components Group

UK . 712 parts In-Stock

1+ parts

$23.653

100+ parts

$22.470

1k+ parts

$21.288

10k+ parts

-

712

$23.653

$22.470

$21.288

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Lixinc

USA . 14,910 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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14,910

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Perfect Parts

USA . 1,258 parts In-Stock

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1,258

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Microchip USA

USA . 254 parts In-Stock

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254

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Overview

Unlock seamless data transmission with the SN74AVC32T245GKER by Texas Instruments, a high-quality bus driver & transceiver perfect for a wide range of applications. With 4 functions in one compact package, this product delivers fast propagation delay and versatile voltage translation capabilities. Trust in Texas Instruments' reputation for reliability and innovation to ensure top-notch performance. Elevate your designs with the value and benefits this product brings to your projects, providing efficient and effective solutions for your connectivity needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and reliability for the product, ensuring a long lifespan.

Propagation Delay At Nominal Supply: 6.2 ns

Low propagation delay ensures fast and efficient data transmission in the bus driver.

Surface Mount: YES

Surface mount capability allows for easy installation and integration into electronic systems.

No. of Functions: 4

Having multiple functions in a single chip simplifies the design and reduces the component count in the system.

Package Shape: RECTANGULAR

Rectangular shape makes it easy to place and mount the bus driver within a circuit board layout.

No. of Bits: 8

8 bits provide sufficient data transfer capabilities for various applications in communication systems.

Nominal Supply Voltage / Vsup (V): 1.5

Stable supply voltage ensures consistent performance of the bus driver.

Load Capacitance (CL): 15 pF

Appropriate load capacitance ensures signal integrity and prevents signal distortion.

Maximum Operating Temperature: 85 °C

High operating temperature range makes this bus driver suitable for industrial applications.

Output Characteristics: 3-STATE

3-state output allows for multiple devices to be connected to the bus without causing any conflicts.

Technical Specifications

Bus Driver & Transceivers SN74AVC32T245GKER attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

AVC

JESD-30 Code:

R-PBGA-B96

JESD-609 Code:

e0

Length:

13.5 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

2

No. of Bits:

8

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

96

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA96,6X16,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

235

Power Supplies (V):

1.5/3.3

Maximum Power Supply Current (ICC):

.09 mA

Propagation Delay At Nominal Supply:

6.2 ns

Propagation Delay (tpd):

6.2 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage / Vsup (V):

1.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Translation:

1.5/3.3V&1.5/3.3V

Width:

5.5 mm

Trade Compliance

SN74AVC32T245GKER Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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