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SN74AVC16245DGG

Texas Instruments

SN74AVC16245DGG by Texas Instruments

SN74AVC16245DGG by Texas Instruments is an 8-bit bus driver with 2 functions, operating at a supply voltage range of 1.4V to 3.6V. It features a propagation delay of 4ns and supports industrial temperature grade applications. This CMOS technology transceiver has a small outline package with dual terminals, making it suitable for various electronic systems requiring fast signal transmission.

Median Price

$2.913

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 776 parts In-Stock

1+ parts

-

100+ parts

$2.600

1k+ parts

$2.330

10k+ parts

$2.190

776

-

$2.600

$2.330

$2.190

DigiKey

USA . 776 parts In-Stock

1+ parts

-

100+ parts

$3.430

1k+ parts

-

10k+ parts

-

776

-

$3.430

-

-

Verical

USA . 776 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.913

10k+ parts

$2.737

776

-

-

$2.913

$2.737

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,463 parts In-Stock

1+ parts

$2.746

100+ parts

-

1k+ parts

-

10k+ parts

-

3,463

$2.746

-

-

-

Vyrian

USA . 5,285 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,285

-

-

-

-

DigiKey Marketplace

USA . 976 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

976

-

-

-

-

Pegasus Components GmbH

Germany . 60 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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60

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,719 parts In-Stock

1+ parts

$2.601

100+ parts

-

1k+ parts

-

10k+ parts

-

2,719

$2.601

-

-

-

Andel Nordic

Denmark . 4,880 parts In-Stock

1+ parts

$2.659

100+ parts

-

1k+ parts

$2.552

10k+ parts

$2.552

4,880

$2.659

-

$2.552

$2.552

Component Stockers USA

USA . 1,194 parts In-Stock

1+ parts

$2.950

100+ parts

$2.770

1k+ parts

-

10k+ parts

-

1,194

$2.950

$2.770

-

-

Parana Technologies

USA . 1,451 parts In-Stock

1+ parts

$19.504

100+ parts

-

1k+ parts

$19.512

10k+ parts

-

1,451

$19.504

-

$19.512

-

DigiPath Technology Company

USA . 1,346 parts In-Stock

1+ parts

$21.477

100+ parts

-

1k+ parts

-

10k+ parts

-

1,346

$21.477

-

-

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ChromeModa Solutions

Germany . 4,561 parts In-Stock

1+ parts

$21.915

100+ parts

$17.970

1k+ parts

-

10k+ parts

-

4,561

$21.915

$17.970

-

-

IDEA Electronic Components Group

UK . 1,336 parts In-Stock

1+ parts

$21.915

100+ parts

$20.819

1k+ parts

$19.724

10k+ parts

-

1,336

$21.915

$20.819

$19.724

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QUARKTWIN TECHNOLOGY LTD

USA . 14,548 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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14,548

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Perfect Parts

USA . 560 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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560

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Overview

Unlock seamless data transmission with the SN74AVC16245DGG from Texas Instruments. As a trusted leader in the industry, Texas Instruments delivers unparalleled quality and reliability. This bus driver & transceiver is perfect for a wide range of applications, offering customers value and peace of mind. Experience fast propagation delay, 3-state output characteristics, and a compact design that fits any project. Trust Texas Instruments to provide innovative solutions for all your connectivity needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and lightweight, making the product suitable for transportation applications.

Surface Mount: YES

Surface mount compatibility allows for easy integration into circuit boards, saving space and simplifying manufacturing processes.

No. of Functions: 2

Having multiple functions in a single component increases efficiency and reduces the need for additional components.

Package Shape: RECTANGULAR

Rectangular shape is easy to handle and fits well in standard electronic layouts.

No. of Bits: 8

8-bit capability allows for a wide range of data processing and communication.

Nominal Supply Voltage / Vsup (V): 1.5

Operates at a standard supply voltage, making it compatible with many systems.

No. of Terminals: 48

Having a high number of terminals allows for versatile connectivity options.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact size and thin profile save space in electronic devices and improve overall design aesthetics.

Propagation Delay (tpd): 4 ns

Low propagation delay ensures fast data transmission and processing speeds.

Maximum Operating Temperature: 85 °C

Can operate in high-temperature environments, suitable for industrial applications.

Output Characteristics: 3-STATE

3-state output allows for high impedance output, enhancing flexibility in circuit design.

Minimum Operating Temperature: -40 °C

Can withstand low temperatures, ensuring reliable operation in various environments.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish enhances conductivity and corrosion resistance for long-term reliability.

Terminal Position: DUAL

Dual terminal position provides multiple points for secure connections.

No. of Ports: 2

Having multiple ports allows for versatile input/output options.

Maximum Seated Height: 1.2 mm

Low seated height minimizes space requirements and allows for slim device designs.

Width: 6.1 mm

Compact width facilitates easy integration into circuit layouts and saves space.

Output Polarity: TRUE

True output polarity ensures accurate signal processing and compatibility with other components.

Minimum Supply Voltage (Vsup): 1.4 V

Low minimum supply voltage improves energy efficiency and extends battery life.

Maximum Time At Peak Reflow Temperature (s): 30

Extended time at peak reflow temperature allows for reliable soldering during manufacturing processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper soldering and component bonding.

Length: 12.5 mm

Optimal length for integration into electronic devices without taking up excessive space.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable performance in harsh operating conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient operation.

Terminal Form: GULL WING

Gull wing terminal form allows for easy surface mounting and soldering during assembly.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high-density mounting on circuit boards and supports miniaturization.

Maximum Supply Voltage (Vsup): 3.6 V

High maximum supply voltage allows for compatibility with a wide range of power sources.

Technical Specifications

Bus Driver & Transceivers SN74AVC16245DGG attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH DIRECTION CONTROL

Family:

AVC

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

4 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.4 V

Nominal Supply Voltage / Vsup (V):

1.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6.1 mm

Trade Compliance

SN74AVC16245DGG Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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