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SN74AUC32RGYRG4

Texas Instruments

SN74AUC32RGYRG4 by Texas Instruments

SN74AUC32RGYRG4 by Texas Instruments is a Logic Gates chip with 3.5 ns Propagation Delay, 2 Inputs, and 4 Functions. It operates at a Nominal Voltage of 1.2V and has a Max Operating Temperature of 85°C. This chip is ideal for industrial applications requiring fast signal processing in compact electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,210 parts In-Stock

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Digiode

USA . 71 parts In-Stock

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71

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Distributors (Availability)

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One Stop Electronics

USA . 1,140 parts In-Stock

1+ parts

$9.000

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-

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1,140

$9.000

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AZTECH Wire

Italy . 243 parts In-Stock

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$16.587

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243

$16.587

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Parana Technologies

USA . 274 parts In-Stock

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$27.107

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$32.296

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274

$27.107

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$32.296

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DigiPath Technology Company

USA . 1,914 parts In-Stock

1+ parts

$29.848

100+ parts

$27.460

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1,914

$29.848

$27.460

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ChromeModa Solutions

Germany . 2,959 parts In-Stock

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$30.457

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$24.975

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2,959

$30.457

$24.975

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IDEA Electronic Components Group

UK . 2,232 parts In-Stock

1+ parts

$30.457

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$28.934

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$27.411

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2,232

$30.457

$28.934

$27.411

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Component Stockers USA

USA . 333 parts In-Stock

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$99.990

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333

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Corphita

USA . 3,894 parts In-Stock

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Microchip USA

USA . 1,239 parts In-Stock

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Overview

Unlock a world of possibilities with the SN74AUC32RGYRG4 logic gate by Texas Instruments. Designed with precision and quality in mind, this versatile chip offers fast propagation delay, low power consumption, and 3-state output characteristics. Ideal for industrial applications, this logic gate is a game-changer for engineers looking to optimize their designs. Whether you're working on robotics, automation, or telecommunications projects, this reliable component will exceed your expectations. Trust in Texas Instruments for innovative solutions that deliver value and performance every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and long-lasting.

Propagation Delay At Nominal Supply: 3.5 ns

The fast propagation delay ensures quick response time in processing signals, making it suitable for high-speed applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving space and reducing production costs.

No. of Functions: 4

With multiple functions in a single package, this product offers cost and space efficiency for circuit design.

No. of Inputs: 2

The dual input design allows for versatile logic operations and compatibility with various digital systems.

Nominal Supply Voltage / Vsup (V): 1.2

The low supply voltage requirement helps in reducing power consumption and heat generation in the circuit.

Load Capacitance (CL): 15 pF

The low load capacitance ensures efficient signal transmission and minimal signal distortion in the circuit.

Power Supplies (V): 1.2/2.5

This product is versatile in voltage compatibility, allowing flexibility in various circuit configurations.

No. of Terminals: 14

Having multiple terminals enables easy connectivity with other components in the circuit, enhancing versatility.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The different package styles offer flexibility in design and cooling options for the product in various applications.

Technical Specifications

Logic Gates SN74AUC32RGYRG4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

AUC

JESD-30 Code:

S-PQCC-N14

JESD-609 Code:

e4

Length:

3.5 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum I (ol):

9 Amp

Moisture Sensitivity Level (MSL):

2

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC14/18,.14SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/2.5

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

3.5 ns

Propagation Delay (tpd):

3.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

2.7 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage / Vsup (V):

1.2

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.5 mm

Trade Compliance

SN74AUC32RGYRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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