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SN74AUC2G79DCURG4

Texas Instruments

SN74AUC2G79DCURG4 by Texas Instruments

SN74AUC2G79DCURG4 by Texas Instruments is a latches & flip-flops IC with 3.9 ns propagation delay, suitable for industrial applications. It operates at a nominal voltage of 1.2V and has a max frequency of 275 MHz, making it ideal for high-speed digital circuits in compact designs. With surface mount capability and dual terminal position, this CMOS technology-based component offers efficient performance in tight spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,336 parts In-Stock

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Digiode

USA . 607 parts In-Stock

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607

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Distributors (Availability)

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AZTECH Wire

Italy . 218 parts In-Stock

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$13.095

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218

$13.095

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Parana Technologies

USA . 2,170 parts In-Stock

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$13.732

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$14.221

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2,170

$13.732

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DigiPath Technology Company

USA . 283 parts In-Stock

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$15.120

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$13.911

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283

$15.120

$13.911

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ChromeModa Solutions

Germany . 3,791 parts In-Stock

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$15.429

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$12.652

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3,791

$15.429

$12.652

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IDEA Electronic Components Group

UK . 1,417 parts In-Stock

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$15.429

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$14.658

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$13.886

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1,417

$15.429

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$13.886

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One Stop Electronics

USA . 1,347 parts In-Stock

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$29.000

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Component Stockers USA

USA . 348 parts In-Stock

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$99.990

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Microchip USA

USA . 1,352 parts In-Stock

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Corphita

USA . 56 parts In-Stock

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Overview

Enhance your electronic designs with the SN74AUC2G79DCURG4 by Texas Instruments, a top-tier manufacturer known for excellence in the field of latches & flip-flops. This versatile component offers customers unparalleled value with its fast propagation delay, low power consumption, and wide operating temperature range. Perfect for applications requiring reliable data storage and transfer, this small outline package is surface mountable for easy integration into your projects. Trust Texas Instruments to deliver cutting-edge technology that meets and exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the latch & flip-flop durable and resistant to external elements.

Propagation Delay At Nominal Supply: 3.9 ns

Low propagation delay ensures fast switching and response times, making this product ideal for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving time and effort.

No. of Functions: 2

Having multiple functions in one component increases efficiency and reduces the need for additional components.

Nominal Supply Voltage / Vsup (V): 1.2

Operating at a low supply voltage of 1.2V promotes energy efficiency and reduces power consumption.

Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

The compact and thin profile of the package saves space on the PCB and allows for high-density designs.

Maximum I (ol): 5 Amp

The high maximum output current rating of 5A ensures that the latch & flip-flop can drive heavy loads without overheating.

Trigger Type: POSITIVE EDGE

Positive edge triggering ensures accurate and reliable operation in digital circuits.

Maximum Frequency At Nominal Supply: 200000000 Hz

With a high maximum frequency, this latch & flip-flop is suitable for applications requiring high-speed signal processing.

Technical Specifications

Latches & Flip-Flops SN74AUC2G79DCURG4 attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

AUC

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

2.3 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

200000000 Hz

Maximum I (ol):

5 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/2.5

Propagation Delay At Nominal Supply:

3.9 ns

Propagation Delay (tpd):

3.9 ns

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

2.7 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage / Vsup (V):

1.2

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

2 mm

Minimum fmax:

275 MHz

Trade Compliance

SN74AUC2G79DCURG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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