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SN74AUC1G07DBVRG4

Texas Instruments

SN74AUC1G07DBVRG4 by Texas Instruments

SN74AUC1G07DBVRG4 by Texas Instruments is a logic gate with 3.3 ns propagation delay, 15 pF load capacitance, and 9 Amp max I (ol). It is used in industrial applications for open-drain output characteristics and operates at temperatures ranging from -40 to 85 °C.

Median Price

$0.396

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 96,750 parts In-Stock

1+ parts

$0.396

100+ parts

$0.269

1k+ parts

$0.138

10k+ parts

-

96,750

$0.396

$0.269

$0.138

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,470 parts In-Stock

1+ parts

$0.376

100+ parts

-

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-

10k+ parts

-

4,470

$0.376

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-

-

Vyrian

USA . 2,899 parts In-Stock

1+ parts

-

100+ parts

-

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-

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2,899

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,642 parts In-Stock

1+ parts

$0.356

100+ parts

-

1k+ parts

-

10k+ parts

-

2,642

$0.356

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-

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AZTECH Wire

Italy . 544 parts In-Stock

1+ parts

$9.120

100+ parts

-

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544

$9.120

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-

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Parana Technologies

USA . 454 parts In-Stock

1+ parts

$24.366

100+ parts

-

1k+ parts

$25.038

10k+ parts

-

454

$24.366

-

$25.038

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DigiPath Technology Company

USA . 2,297 parts In-Stock

1+ parts

$26.829

100+ parts

-

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-

10k+ parts

-

2,297

$26.829

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ChromeModa Solutions

Germany . 4,277 parts In-Stock

1+ parts

$27.377

100+ parts

$22.449

1k+ parts

-

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4,277

$27.377

$22.449

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IDEA Electronic Components Group

UK . 753 parts In-Stock

1+ parts

$27.377

100+ parts

$26.008

1k+ parts

$24.639

10k+ parts

-

753

$27.377

$26.008

$24.639

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Microchip USA

USA . 2,851 parts In-Stock

1+ parts

-

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2,851

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Overview

Experience superior performance with the Texas Instruments SN74AUC1G07DBVRG4 logic gate. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and reliability. Ideal for various applications, this logic gate offers lightning-fast propagation delay, low power consumption, and wide operating temperature range. With its small outline package and open-drain output characteristics, this product provides unmatched value and versatility to customers. Upgrade your designs and streamline your projects with the SN74AUC1G07DBVRG4 from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the logic gates.

Propagation Delay At Nominal Supply: 3.3 ns

Fast propagation delay ensures quick response times in processing logic signals.

Surface Mount: YES

Allows for easy integration onto circuit boards and saves space.

Nominal Supply Voltage: 1.2 V

Efficient power usage with low supply voltage.

Load Capacitance: 15 pF

Optimized for handling capacitance in the circuit.

Maximum I (ol): 9 Amp

Capable of driving high loads with a strong output current.

Output Characteristics: OPEN-DRAIN

Flexible output configuration for various circuit designs.

Technology: CMOS

Low power consumption and high noise immunity characteristics.

Terminal Form: GULL WING

Easy to solder onto circuit boards for secure connections.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments with high temperature requirements.

Technical Specifications

Logic Gates SN74AUC1G07DBVRG4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

AUC

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2.9 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum I (ol):

9 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/2.5

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

3.3 ns

Propagation Delay (tpd):

3.3 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.45 mm

Sub-Category:

Gate

Maximum Supply Voltage (Vsup):

2.7 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage / Vsup (V):

1.2

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.6 mm

Trade Compliance

SN74AUC1G07DBVRG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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