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SN74AS86ADR

Texas Instruments

SN74AS86ADR by Texas Instruments

SN74AS86ADR by Texas Instruments is a TTL logic gate with 4 functions and 2 inputs. It operates at a supply voltage of 5V, with a propagation delay of 7ns. This small outline package is ideal for commercial applications requiring fast signal processing in the temperature range of 0-70°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,766 parts In-Stock

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7,766

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Digiode

USA . 3,785 parts In-Stock

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R&J Components

USA . 2,500 parts In-Stock

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2,500

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Halfin

Belgium . 2,500 parts In-Stock

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2,500

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Distributors (Availability)

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Parana Technologies

USA . 1,135 parts In-Stock

1+ parts

$9.834

100+ parts

$913.282

1k+ parts

$8.851

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1,135

$9.834

$913.282

$8.851

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DigiPath Technology Company

USA . 969 parts In-Stock

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$10.829

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969

$10.829

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ChromeModa Solutions

Germany . 3,473 parts In-Stock

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$11.050

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$9.061

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3,473

$11.050

$9.061

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IDEA Electronic Components Group

UK . 2,255 parts In-Stock

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$11.050

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$10.498

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$9.945

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2,255

$11.050

$10.498

$9.945

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AZTECH Wire

Italy . 434 parts In-Stock

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$13.430

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434

$13.430

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One Stop Electronics

USA . 738 parts In-Stock

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$24.000

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738

$24.000

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Corphita

USA . 2,737 parts In-Stock

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Microchip USA

USA . 101 parts In-Stock

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Overview

Unlock the power of precision and reliability with the SN74AS86ADR by Texas Instruments. As a leader in logic gates, Texas Instruments delivers unmatched quality and performance in every product. Ideal for a wide range of applications, this versatile device features 4 functions and 2 inputs, making it perfect for your project needs. With a low propagation delay and small outline package style, you can trust in the efficiency and accuracy of this component. Elevate your designs and experience the benefits of superior technology with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides good durability and protection for the internal components of the logic gates.

Surface Mount: YES

The surface mount option allows for easy and convenient installation on circuit boards, saving time and effort.

No. of Functions: 4

Having 4 functions in one package offers versatility and efficiency in circuit design.

Nominal Supply Voltage / Vsup (V): 5

Operating at a common supply voltage of 5V makes integration with other components simpler.

Propagation Delay (tpd): 7 ns

The low propagation delay of 7ns ensures fast and reliable signal processing in the circuit.

Technical Specifications

Logic Gates SN74AS86ADR attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

AS

JESD-30 Code:

R-PDSO-G14

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

38 mA

Propagation Delay (tpd):

7 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

SN74AS86ADR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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