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SN74AS245DWR

Texas Instruments

SN74AS245DWR by Texas Instruments

SN74AS245DWR by Texas Instruments is an 8-bit bus driver with a propagation delay of 7.5 ns at 5V, suitable for bidirectional applications. It features a small outline package, operates b/w 0-70°C, and has a max power supply current of 143mA. Ideal for systems requiring fast signal transmission in commercial temperature environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

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Digiode

USA . 4,861 parts In-Stock

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Vyrian

USA . 4,451 parts In-Stock

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Chip Stock

USA . 4,199 parts In-Stock

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Bristol Electronics

USA . 1,355 parts In-Stock

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Atlantic Semiconductor

USA . 1,355 parts In-Stock

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PC Components Company LLC

USA . 989 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 943 parts In-Stock

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Elcom Components

USA . 55 parts In-Stock

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Andel Nordic

Denmark . 3,531 parts In-Stock

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$7.450

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$7.152

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$7.152

3,531

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$7.152

AZTECH Wire

Italy . 592 parts In-Stock

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$12.276

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Parana Technologies

USA . 1,796 parts In-Stock

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$28.421

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$47.279

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DigiPath Technology Company

USA . 1,689 parts In-Stock

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$31.295

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ChromeModa Solutions

Germany . 1,188 parts In-Stock

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$31.934

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$26.186

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IDEA Electronic Components Group

UK . 191 parts In-Stock

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$30.337

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$28.741

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One Stop Electronics

USA . 132 parts In-Stock

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Corphita

USA . 1,069 parts In-Stock

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Kepictronics

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Microchip USA

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Overview

Unlock seamless communication and data transfer with the Texas Instruments SN74AS245DWR Bus Driver & Transceivers. Crafted with precision and expertise, Texas Instruments delivers unparalleled quality and reliability. Ideal for a variety of applications, this product offers lightning-fast propagation delay and 3-state output characteristics. With a small outline package style and a wide terminal pitch, this versatile component ensures smooth operation in any project. Choose Texas Instruments for superior performance and value in every aspect of your design. Experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material offers durability and protection, making this product suitable for harsh operating environments.

Propagation Delay At Nominal Supply: 7.5 ns

Low propagation delay ensures quick and efficient transmission of signals, making this product ideal for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage makes this product compatible with a wide range of electronic systems and devices.

Max I (ol): 64 Amp

High output current capability of 64 Amps ensures reliable performance even under heavy load conditions.

Output Characteristics: 3-STATE

The 3-state output allows for flexible control over the bus lines, making this product versatile in various communication and data transmission scenarios.

Temperature Grade: COMMERCIAL

Designed for commercial temperature ranges, this product is suitable for standard operating environments and applications.

Technology: TTL

Utilizing TTL technology ensures compatibility with TTL logic systems and offers reliable signal transmission.

Technical Specifications

Bus Driver & Transceivers SN74AS245DWR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH DIRECTION CONTROL,84030012A,8403001RA,8403001SA IS DELETED FOR SUBGROUP FIX

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

AS

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

143 mA

Propagation Delay At Nominal Supply:

7.5 ns

Propagation Delay (tpd):

7.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Translation:

N/A

Width:

7.5 mm

Trade Compliance

SN74AS245DWR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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