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SN74AS02NSR

Texas Instruments

SN74AS02NSR by Texas Instruments

SN74AS02NSR by Texas Instruments is a TTL logic gate with 4 functions and 2 inputs. It has a propagation delay of 4.5 ns at a nominal voltage of 5V, making it ideal for high-speed applications in commercial temperature environments. This surface-mount package features a small outline design with nickel/palladium/gold terminal finish and Gull Wing form for easy integration into electronic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,529 parts In-Stock

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3,529

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Digiode

USA . 3,351 parts In-Stock

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3,351

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Distributors (Availability)

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Microchip USA

USA . 1,083 parts In-Stock

1+ parts

$8.845

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1,083

$8.845

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One Stop Electronics

USA . 1,492 parts In-Stock

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$10.000

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1,492

$10.000

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AZTECH Wire

Italy . 641 parts In-Stock

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$19.161

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641

$19.161

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Parana Technologies

USA . 660 parts In-Stock

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$21.474

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$21.853

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660

$21.474

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$21.853

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ChromeModa Solutions

Germany . 6,496 parts In-Stock

1+ parts

$24.128

100+ parts

$19.785

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6,496

$24.128

$19.785

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IDEA Electronic Components Group

UK . 552 parts In-Stock

1+ parts

$24.128

100+ parts

$22.922

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$21.715

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552

$24.128

$22.922

$21.715

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Corphita

USA . 3,277 parts In-Stock

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Kepictronics

USA . 1,320 parts In-Stock

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Perfect Parts

USA . 820 parts In-Stock

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820

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DigiPath Technology Company

USA . 797 parts In-Stock

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$21.754

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797

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$21.754

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Overview

Elevate your project with the SN74AS02NSR logic gates by Texas Instruments, a reliable and high-quality option for your circuitry needs. With a brand known for innovation and excellence, this product offers a seamless integration into various applications, providing customers with unparalleled value and performance. Whether you're looking to enhance your design efficiency or optimize your system functionality, the SN74AS02NSR is the perfect solution for all your logic gate requirements. Trust Texas Instruments to deliver top-notch products that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is known for its durability and resistance to high temperatures, making the product reliable and long-lasting.

Propagation Delay At Nominal Supply: 4.5 ns

The low propagation delay ensures quick response time, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount technology allows for easy assembly and integration into circuit boards, saving space and reducing production costs.

Load Capacitance (CL): 50 pF

The product can handle a moderate load capacitance, making it versatile and compatible with a range of circuit configurations.

Technology: TTL

TTL technology is known for its high speed and low power consumption, making this product efficient and suitable for digital applications.

Technical Specifications

Logic Gates SN74AS02NSR attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

AS

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

10.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

20 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

20.1 mA

Propagation Delay At Nominal Supply:

4.5 ns

Propagation Delay (tpd):

4.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5.3 mm

Trade Compliance

SN74AS02NSR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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