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SN74ALVCH374DWRE4

Texas Instruments

SN74ALVCH374DWRE4 by Texas Instruments

SN74ALVCH374DWRE4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 3.6 ns at 1.8V, suitable for industrial applications. It features a max operating temperature of 85°C, positive edge trigger type, and output polarity as TRUE. This CMOS technology device has a small outline package style and is surface mountable with dual terminal position.

Median Price

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Lifecycle Status

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2

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1k+

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Vyrian

USA . 6,532 parts In-Stock

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Digiode

USA . 217 parts In-Stock

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Andel Nordic

Denmark . 70 parts In-Stock

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$2.179

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$2.092

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$2.092

70

$2.179

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$2.092

AZTECH Wire

Italy . 645 parts In-Stock

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$5.550

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One Stop Electronics

USA . 1,605 parts In-Stock

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Parana Technologies

USA . 2,147 parts In-Stock

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$23.963

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$24.616

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DigiPath Technology Company

USA . 1,846 parts In-Stock

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$26.386

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ChromeModa Solutions

Germany . 6,475 parts In-Stock

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$26.925

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$22.078

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IDEA Electronic Components Group

UK . 1,727 parts In-Stock

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$26.925

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$25.579

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$24.232

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Corphita

USA . 3,111 parts In-Stock

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Microchip USA

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Overview

Enhance the efficiency and reliability of your electronic circuits with the SN74ALVCH374DWRE4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and performance in their products. The SN74ALVCH374DWRE4 falls under the category of Bus Driver & Transceivers and is ideal for a wide range of applications. With a nominal supply voltage of 1.8V and a maximum operating temperature of 85°C, this product offers unparalleled value, benefits, and advantages to customers seeking seamless integration and optimal functionality in their designs. Upgrade your projects today with the superior capabilities of the SN74ALVCH374DWRE4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and robustness, making the product suitable for various environmental conditions.

Propagation Delay At Nominal Supply: 3.6 ns

Low propagation delay ensures fast signal transmission, making the product efficient for time-sensitive applications.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on PCBs, saving space and reducing assembly complexity.

No. of Bits: 8

Having 8 bits allows for versatile data handling and processing capabilities, making the product suitable for a wide range of applications.

Nominal Supply Voltage / Vsup (V): 1.8

Operates at a low supply voltage, making it energy-efficient and suitable for battery-powered devices.

Power Supplies (V): 3.3

Operating at a standard supply voltage of 3.3V ensures compatibility with a wide range of systems and devices.

Output Characteristics: 3-STATE

3-state output allows for high impedance state, which is beneficial for bus systems to prevent contention and enable multiple devices to share the bus efficiently.

Trigger Type: POSITIVE EDGE

Positive edge triggering ensures accurate timing for data transmission, minimizing errors and improving system reliability.

Technology: CMOS

CMOS technology offers low power consumption and noise immunity, making the product energy-efficient and reliable in noisy environments.

Technical Specifications

Bus Driver & Transceivers SN74ALVCH374DWRE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Family:

ALVC/VCX/A

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

3.6 ns

Propagation Delay (tpd):

6.4 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

7.5 mm

Trade Compliance

SN74ALVCH374DWRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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