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SN74ALVCH162841DLR

Texas Instruments

SN74ALVCH162841DLR by Texas Instruments

SN74ALVCH162841DLR by Texas Instruments is a 10-bit bus driver with 3.3V power supplies, 4.3ns propagation delay, and 12 Amp max I (ol). It is used in industrial applications requiring true output polarity and operates within a temperature range of -40 to 85 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,405 parts In-Stock

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Digiode

USA . 836 parts In-Stock

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836

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Andel Nordic

Denmark . 3,361 parts In-Stock

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$6.180

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-

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$5.933

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$5.933

3,361

$6.180

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$5.933

$5.933

AZTECH Wire

Italy . 563 parts In-Stock

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$6.843

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One Stop Electronics

USA . 1,247 parts In-Stock

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$21.000

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Parana Technologies

USA . 248 parts In-Stock

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$26.032

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$26.621

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248

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$26.621

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ChromeModa Solutions

Germany . 4,561 parts In-Stock

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$29.249

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$23.984

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IDEA Electronic Components Group

UK . 111 parts In-Stock

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$29.249

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$27.787

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$26.324

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111

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$26.324

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QUARKTWIN TECHNOLOGY LTD

USA . 26,673 parts In-Stock

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Microchip USA

USA . 4,170 parts In-Stock

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DigiPath Technology Company

USA . 612 parts In-Stock

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$26.371

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Corphita

USA . 385 parts In-Stock

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Overview

Unlock seamless communication and reliable data transfer with the SN74ALVCH162841DLR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and innovative solutions. This bus driver and transceiver device is designed to meet your needs with its fast propagation delay and low power consumption. Whether you're in the automotive, industrial, or consumer electronics sector, this product offers valuable benefits such as high performance, flexibility, and compatibility. Trust Texas Instruments for cutting-edge technology that enhances your applications.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ensuring it can withstand daily wear and tear in a bus driver environment.

Propagation Delay At Nominal Supply: 4.3 ns

With a low propagation delay, this product ensures fast and efficient communication within the bus driver system, leading to quick response times.

Surface Mount: YES

Being surface mountable makes installation of this product easy and convenient in bus driver applications, saving time and effort during assembly.

Package Shape: RECTANGULAR

The rectangular package shape offers a compact design, allowing for space-saving integration of this product into bus driver systems.

Nominal Supply Voltage / Vsup (V): 1.8

The low nominal supply voltage of 1.8V contributes to energy efficiency in bus driver applications, helping to reduce power consumption.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this product can withstand temperature fluctuations in bus driver environments, ensuring reliable performance.

Technology: CMOS

The CMOS technology used in this product offers low power consumption and high noise immunity, making it a suitable choice for bus driver applications requiring efficiency and reliability.

Technical Specifications

Bus Driver & Transceivers SN74ALVCH162841DLR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Family:

ALVC/VCX/A

JESD-30 Code:

R-PDSO-G56

Length:

18.415 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

12 Amp

No. of Bits:

10

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP56,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

4.3 ns

Propagation Delay (tpd):

5.9 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.79 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.49 mm

Trade Compliance

SN74ALVCH162841DLR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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