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SN74ALVCF162834VR

Texas Instruments

SN74ALVCF162834VR by Texas Instruments

SN74ALVCF162834VR by Texas Instruments is an 18-bit bus driver with a propagation delay of 3.5 ns at 2.5V, suitable for industrial applications. It features a small outline package with a thin profile and shrink pitch, operating b/w -40 to 85 °C, making it ideal for high-speed data transmission in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,963 parts In-Stock

1+ parts

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8,963

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Digiode

USA . 1,085 parts In-Stock

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1,085

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 200 parts In-Stock

1+ parts

$7.024

100+ parts

-

1k+ parts

$6.744

10k+ parts

$6.744

200

$7.024

-

$6.744

$6.744

AZTECH Wire

Italy . 842 parts In-Stock

1+ parts

$12.141

100+ parts

-

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842

$12.141

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Parana Technologies

USA . 1,778 parts In-Stock

1+ parts

$28.589

100+ parts

-

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$49.253

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1,778

$28.589

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$49.253

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DigiPath Technology Company

USA . 455 parts In-Stock

1+ parts

$31.481

100+ parts

$28.962

1k+ parts

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455

$31.481

$28.962

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IDEA Electronic Components Group

UK . 1,838 parts In-Stock

1+ parts

$32.123

100+ parts

$30.517

1k+ parts

$28.911

10k+ parts

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1,838

$32.123

$30.517

$28.911

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ChromeModa Solutions

Germany . 209 parts In-Stock

1+ parts

$32.123

100+ parts

$26.341

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209

$32.123

$26.341

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One Stop Electronics

USA . 1,211 parts In-Stock

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$37.000

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1,211

$37.000

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Corphita

USA . 4,399 parts In-Stock

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4,399

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Microchip USA

USA . 378 parts In-Stock

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378

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Overview

Enhance your electronic designs with the SN74ALVCF162834VR by Texas Instruments, a top-tier manufacturer known for superior quality and reliability. As a leading product in the Bus Driver & Transceivers category, this versatile component offers seamless integration and high performance. With a nominal supply voltage of 2.5V and propagation delay of just 3.5ns, it ensures optimal efficiency in various applications. Experience the value and benefits of this innovative solution, from its compact design to its advanced output characteristics. Elevate your projects with the SN74ALVCF162834VR and unlock new possibilities in electronic engineering.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for use in various applications.

Propagation Delay At Nominal Supply: 3.5 ns

The low propagation delay ensures fast and efficient signal transmission, making the product suitable for high-speed communication systems.

Surface Mount: YES

Being surface mountable allows for easy and convenient integration into circuit boards, saving space and reducing assembly time.

Nominal Supply Voltage / Vsup (V): 2.5

Operating at a low nominal supply voltage of 2.5V helps in reducing power consumption and heat dissipation, making the product energy-efficient.

No. of Terminals: 56

Having a large number of terminals provides flexibility in connecting to other components, enhancing the product's compatibility and functionality.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, the product can withstand harsh environmental conditions, increasing its reliability and longevity.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high noise immunity, making the product suitable for battery-powered devices and noise-sensitive applications.

Technical Specifications

Bus Driver & Transceivers SN74ALVCF162834VR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Family:

ALVC/VCX/A

JESD-30 Code:

R-PDSO-G56

Length:

11.3 mm

Logic IC Type:

Maximum I (ol):

18 Amp

No. of Bits:

18

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP56,.25,16

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

3.5 ns

Propagation Delay (tpd):

5.9 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

SN74ALVCF162834VR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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