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SN74ALS874BDWRE4

Texas Instruments

SN74ALS874BDWRE4 by Texas Instruments

SN74ALS874BDWRE4 by Texas Instruments is a TTL technology bus driver with 14 ns propagation delay, 2 functions, and 4 bits. It operates at a supply voltage of 5V and has a max frequency of 30 MHz. Ideal for unidirectional control applications requiring independent control in commercial temperature grades.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,292 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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5,292

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Digiode

USA . 3,410 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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3,410

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 721 parts In-Stock

1+ parts

$14.306

100+ parts

-

1k+ parts

$14.755

10k+ parts

-

721

$14.306

-

$14.755

-

DigiPath Technology Company

USA . 2,378 parts In-Stock

1+ parts

$15.753

100+ parts

$14.492

1k+ parts

-

10k+ parts

-

2,378

$15.753

$14.492

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ChromeModa Solutions

Germany . 1,899 parts In-Stock

1+ parts

$16.074

100+ parts

$13.181

1k+ parts

-

10k+ parts

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1,899

$16.074

$13.181

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IDEA Electronic Components Group

UK . 865 parts In-Stock

1+ parts

$16.074

100+ parts

$15.270

1k+ parts

$14.467

10k+ parts

-

865

$16.074

$15.270

$14.467

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AZTECH Wire

Italy . 340 parts In-Stock

1+ parts

$19.277

100+ parts

-

1k+ parts

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10k+ parts

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340

$19.277

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One Stop Electronics

USA . 1,535 parts In-Stock

1+ parts

$50.000

100+ parts

-

1k+ parts

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10k+ parts

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1,535

$50.000

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Corphita

USA . 2,890 parts In-Stock

1+ parts

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2,890

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Microchip USA

USA . 2,280 parts In-Stock

1+ parts

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100+ parts

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2,280

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Overview

Enhance your electronic designs with the SN74ALS874BDWRE4 by Texas Instruments, a top-tier manufacturer known for delivering high-quality Bus Driver & Transceivers. With its advanced technology and reliable performance, this product offers superior functionality in various applications. Experience seamless data transmission, increased efficiency, and improved signal integrity with this versatile component. Trust Texas Instruments to provide you with innovative solutions that meet your needs and exceed your expectations. Elevate your projects with the exceptional value and benefits that this product brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Using plastic/epoxy material for the package body makes this product lightweight and durable.

Propagation Delay At Nominal Supply: 14 ns

Low propagation delay ensures quick signal transmission, making this product suitable for high-speed applications.

Surface Mount: YES

Being surface mountable, this product is easy to install and saves space on the circuit board.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage makes this product compatible with a wide range of systems.

No. of Functions: 2

Having 2 functions in this product allows for versatile use in various applications.

Package Shape: RECTANGULAR

Rectangular package shape provides ease of handling and PCB layout.

Output Characteristics: 3-STATE

3-state output allows for high impedance, which is useful in bus line communication.

Technology: TTL

TTL technology ensures compatibility with TTL logic systems, making integration seamless.

Technical Specifications

Bus Driver & Transceivers SN74ALS874BDWRE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH CLEAR

Control Type:

INDEPENDENT CONTROL

Count Direction:

UNIDIRECTIONAL

Family:

ALS

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

15.4 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

30000000 Hz

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

30 mA

Propagation Delay At Nominal Supply:

14 ns

Propagation Delay (tpd):

14 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Trigger Type:

POSITIVE EDGE

Width:

7.5 mm

Trade Compliance

SN74ALS874BDWRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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