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SN74ALS873BNT

Texas Instruments

SN74ALS873BNT by Texas Instruments

SN74ALS873BNT by Texas Instruments is a TTL technology bus driver with 2 functions, 4 bits, and 3-STATE output characteristics. It has a propagation delay of 14 ns at nominal voltage of 5V, making it ideal for applications requiring fast signal transmission in commercial temperature environments. The package style is IN-LINE with through-hole terminal form and nickel palladium gold finish.

Median Price

$1.591

Lifecycle Status

Suppliers In-Stock

25

In-Stock Inventory

1k+

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American Microsemiconductor Inc.

USA . 644 parts In-Stock

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Digiode

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Vyrian

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Bristol Electronics

USA . 429 parts In-Stock

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A2Z Electronics, Inc.

USA . 374 parts In-Stock

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Odi Ramu Company

Canada . 320 parts In-Stock

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Extreme Components

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Electronic Expediters

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Mentor Electronics Marketing, LLC

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Kronex Distribution GmbH

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Prism Electronics

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PC Components Company LLC

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Electronics Depot

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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Sunrise Surplus Inc.

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MISTER SPROCKETS

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Fibra_Brandt Electronic GMBH

Germany . 15 parts In-Stock

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Manoshevitz Elec. Sales

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Inland Empire Components Inc.

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Resion

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GES GmbH

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Mil-Aero Solutions, Inc.

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Halfin

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Ack Elektronik San.Tic.Ltd.Sti

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Standard Data Resources

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AZTECH Wire

Italy . 376 parts In-Stock

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Parana Technologies

USA . 469 parts In-Stock

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ChromeModa Solutions

Germany . 3,058 parts In-Stock

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IDEA Electronic Components Group

UK . 1,051 parts In-Stock

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One Stop Electronics

USA . 558 parts In-Stock

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Authorized Procurement Solutions

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Corphita

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A-Z Elektronik GmbH

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DigiPath Technology Company

USA . 616 parts In-Stock

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Microchip USA

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Assy Fe

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Overview

Elevate your electronics projects with the high-quality SN74ALS873BNT by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers reliable and efficient solutions for Bus Driver & Transceivers. With a compact rectangular package and 3-STATE output characteristics, this product offers unmatched performance and versatility. Whether you're designing communication systems, industrial control applications, or computer peripherals, this 4-bit bus driver ensures fast propagation delays and low power consumption, making it a valuable addition to your toolkit. Experience seamless integration and superior functionality with Texas Instruments' SN74ALS873BNT.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and resistance to environmental factors, making this product suitable for rugged usage in buses.

Propagation Delay at Nominal Supply: 14 ns

Low propagation delay ensures quick response time, making this product efficient for real-time bus driver and transceiver applications.

No. of Functions: 2

Having multiple functions in a single device saves space and simplifies the circuit design for bus communication systems.

Load Capacitance (CL): 50 pF

Optimal load capacitance ensures stable operation and efficient signal transmission in bus communication networks.

Output Characteristics: 3-STATE

3-STATE output allows the driver to actively control the bus signals, enabling flexibility in managing the communication flow.

Technology: TTL

TTL technology offers reliable and standardized signal levels, ensuring compatibility with other TTL-based bus components.

Technical Specifications

Bus Driver & Transceivers SN74ALS873BNT attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH CLEAR

Family:

ALS

JESD-30 Code:

R-PDIP-T24

JESD-609 Code:

e4

Length:

31.64 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP24,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

29 mA

Propagation Delay At Nominal Supply:

14 ns

Propagation Delay (tpd):

21 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Bus Driver/Transceiver

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

SN74ALS873BNT Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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