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SN74ALS760DWR

Texas Instruments

SN74ALS760DWR by Texas Instruments

SN74ALS760DWR by Texas Instruments is a TTL technology bus driver with 2 functions, 4 bits, and open-collector output. It operates at a supply voltage range of 4.5V to 5.5V, has a propagation delay of 15ns, and can handle up to 24A max I (ol). This small outline package is ideal for applications requiring fast signal transmission in commercial temperature environments.

Median Price

$2.935

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 138 parts In-Stock

1+ parts

-

100+ parts

$2.770

1k+ parts

$2.480

10k+ parts

$2.340

138

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$2.770

$2.480

$2.340

Verical

USA . 138 parts In-Stock

1+ parts

-

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$3.100

10k+ parts

$2.925

138

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$3.100

$2.925

Distributors (In-Stock)

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Digiode

USA . 3,564 parts In-Stock

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$2.926

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$2.926

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Vyrian

USA . 8,958 parts In-Stock

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DigiKey Marketplace

USA . 513 parts In-Stock

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513

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Bristol Electronics

USA . 400 parts In-Stock

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400

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R&J Components

USA . 172 parts In-Stock

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Semi Source

USA . 87 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 3,318 parts In-Stock

1+ parts

$2.772

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3,318

$2.772

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AZTECH Wire

Italy . 528 parts In-Stock

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$18.170

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528

$18.170

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Parana Technologies

USA . 1,509 parts In-Stock

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$28.429

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$47.380

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1,509

$28.429

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$47.380

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DigiPath Technology Company

USA . 2,086 parts In-Stock

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$31.304

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2,086

$31.304

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ChromeModa Solutions

Germany . 5,687 parts In-Stock

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$31.943

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$26.193

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5,687

$31.943

$26.193

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IDEA Electronic Components Group

UK . 1,053 parts In-Stock

1+ parts

$31.943

100+ parts

$30.346

1k+ parts

$28.749

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1,053

$31.943

$30.346

$28.749

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Microchip USA

USA . 464 parts In-Stock

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Overview

Experience unparalleled performance and reliability with the SN74ALS760DWR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality bus drivers & transceivers like this one, designed to meet your specific needs. Whether you're looking to enhance data transmission or improve signal integrity, this product offers exceptional value and benefits. Trust Texas Instruments for all your electronic component needs and unlock the full potential of your applications.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material ensures durability and reliability of the product, making it a good choice for long-term usage.

Surface Mount: YES

Surface mount capability allows for easy installation and integration into circuit boards, making it convenient for manufacturers to use in their designs.

No. of Functions: 2

Having 2 functions in one device offers efficiency and compactness, making it a cost-effective solution for bus driver and transceiver applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V ensures compatibility with standard voltage levels, making it easy to integrate with existing systems.

Propagation Delay (tpd): 15 ns

Low propagation delay of 15 ns ensures fast signal transmission, reducing latency and improving overall system performance.

Output Characteristics: OPEN-COLLECTOR

Open-collector output allows for flexible interfacing with external components, making it versatile and adaptable for different bus communication protocols.

Technology: TTL

Using TTL technology ensures high noise immunity and reliable operation, making it suitable for industrial applications where robustness is required.

Technical Specifications

Bus Driver & Transceivers SN74ALS760DWR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Family:

ALS

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-COLLECTOR

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Power Supply Current (ICC):

19 mA

Propagation Delay (tpd):

15 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

SN74ALS760DWR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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