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SN74ALS666NT

Texas Instruments

SN74ALS666NT by Texas Instruments

SN74ALS666NT by Texas Instruments is an 8-bit bus driver with a propagation delay of 18 ns at 5V. It features 3-STATE output characteristics and operates within a temperature range of 0 to 70°C. Ideal for applications requiring fast signal transmission in commercial-grade environments.

Median Price

$6.480

Lifecycle Status

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34

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Freelance Electronics

USA . 35 parts In-Stock

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$5.415

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$6.498

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American Microsemiconductor Inc.

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Speed Components Ltd

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Standard Data Resources

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North Shore Components

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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Right Parts Inc.

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MRC Electronics

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PC Components Company LLC

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Flex Direct, LLC

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EPE Components Inc.

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Zilex Electronics Inc.

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Pegasus Components GmbH

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First Choice Components Inc.

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Holdelec - ElecDif-Pro

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Andel Nordic

Denmark . 708 parts In-Stock

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$3.655

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$3.509

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Parana Technologies

USA . 1,899 parts In-Stock

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$10.866

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ChromeModa Solutions

Germany . 5,915 parts In-Stock

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IDEA Electronic Components Group

UK . 103 parts In-Stock

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Microchip USA

USA . 165 parts In-Stock

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$19.010

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$18.740

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AZTECH Wire

Italy . 455 parts In-Stock

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One Stop Electronics

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Corphita

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DigiPath Technology Company

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Overview

Enhance your electronic designs with the SN74ALS666NT by Texas Instruments, a top-quality Bus Driver & Transceiver that offers unparalleled performance and reliability. With its advanced technology and durable construction, this product is perfect for a wide range of applications. From industrial automation to telecommunications, this component provides seamless connectivity and efficient data transmission. Trust Texas Instruments to deliver cutting-edge solutions that exceed your expectations. Elevate your projects with the SN74ALS666NT and experience innovation at its finest.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protects the internal components of the Bus Driver & Transceivers, making it a reliable choice for long-term use.

Propagation Delay At Nominal Supply: 18 ns

The low propagation delay ensures fast signal transmission, making this product suitable for high-speed communication applications.

No. of Bits: 8

The 8-bit capacity allows for processing a larger amount of data, making the Bus Driver & Transceivers suitable for applications that require handling multiple inputs or outputs.

Nominal Supply Voltage / Vsup (V): 5

The 5V nominal supply voltage is a common standard in many electronic systems, ensuring compatibility and ease of integration with existing setups.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature tolerance of 70°C allows the Bus Driver & Transceivers to function reliably in various environmental conditions.

Technical Specifications

Bus Driver & Transceivers SN74ALS666NT attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH CLEAR AND PRESET; WITH DUAL OUTPUT ENABLE; WITH READ-BACK

Family:

ALS

JESD-30 Code:

R-PDIP-T24

JESD-609 Code:

e4

Length:

31.64 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP24,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

73 mA

Propagation Delay At Nominal Supply:

18 ns

Propagation Delay (tpd):

27 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Bus Driver/Transceiver

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

SN74ALS666NT Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-509-7878, 5962015097878

NIIN

015097878

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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