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SN74ALS666DWG4

Texas Instruments

SN74ALS666DWG4 by Texas Instruments

SN74ALS666DWG4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 18 ns at 5V. It features a small outline package, 3-STATE output characteristics, and operates within a temperature range of 0 to 70°C. Ideal for applications requiring fast signal transmission in commercial-grade environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,783 parts In-Stock

1+ parts

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7,783

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Digiode

USA . 1,647 parts In-Stock

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1,647

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Distributors (Availability)

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Andel Nordic

Denmark . 2,780 parts In-Stock

1+ parts

$3.375

100+ parts

-

1k+ parts

$3.240

10k+ parts

$3.240

2,780

$3.375

-

$3.240

$3.240

AZTECH Wire

Italy . 364 parts In-Stock

1+ parts

$10.822

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364

$10.822

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One Stop Electronics

USA . 1,419 parts In-Stock

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$27.000

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1,419

$27.000

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Parana Technologies

USA . 207 parts In-Stock

1+ parts

$28.711

100+ parts

-

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$50.880

10k+ parts

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207

$28.711

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$50.880

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DigiPath Technology Company

USA . 1,618 parts In-Stock

1+ parts

$31.615

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1,618

$31.615

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ChromeModa Solutions

Germany . 2,516 parts In-Stock

1+ parts

$32.260

100+ parts

$26.453

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2,516

$32.260

$26.453

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IDEA Electronic Components Group

UK . 1,478 parts In-Stock

1+ parts

$32.260

100+ parts

$30.647

1k+ parts

$29.034

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1,478

$32.260

$30.647

$29.034

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Corphita

USA . 3,948 parts In-Stock

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3,948

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Microchip USA

USA . 2,227 parts In-Stock

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2,227

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Overview

Enhance the efficiency of your electronic circuits with the SN74ALS666DWG4 by Texas Instruments, a top-tier manufacturer known for superior quality and reliability. This Bus Driver & Transceiver offers seamless communication between components, ensuring optimal performance in diverse applications. With a compact package design and low propagation delay, this product delivers exceptional value by streamlining data transmission and enhancing overall system functionality. Elevate your projects with the precision and innovation that Texas Instruments is renowned for – choose the SN74ALS666DWG4 for unparalleled results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the bus driver & transceiver, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 18 ns

With a fast propagation delay, this product can efficiently transmit data signals without significant delay, making it suitable for high-speed applications.

Surface Mount: YES

The surface mount feature allows for easy installation on printed circuit boards, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V makes this bus driver & transceiver compatible with common electronics and power sources.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board, ideal for compact electronic designs.

Output Characteristics: 3-STATE

The 3-STATE output allows for tri-state logic control, offering flexibility in managing signal outputs.

Technology: TTL

Using TTL technology ensures reliability and compatibility with other TTL-based components in the system.

Technical Specifications

Bus Driver & Transceivers SN74ALS666DWG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH CLEAR AND PRESET; WITH DUAL OUTPUT ENABLE; WITH READ-BACK

Control Type:

ENABLE LOW/HIGH

Count Direction:

UNIDIRECTIONAL

Family:

ALS

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

15.4 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

73 mA

Propagation Delay At Nominal Supply:

18 ns

Propagation Delay (tpd):

27 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Width:

7.5 mm

Trade Compliance

SN74ALS666DWG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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