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SN74ALS640BDWRE4

Texas Instruments

SN74ALS640BDWRE4 by Texas Instruments

SN74ALS640BDWRE4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 11ns at 5V. It features a 3-STATE output and operates within a temperature range of 0 to 70°C. Commonly used in bidirectional control applications due to its TTL technology and dual terminal position.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,962 parts In-Stock

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Digiode

USA . 4,122 parts In-Stock

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4,122

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Andel Nordic

Denmark . 3,953 parts In-Stock

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$3.964

100+ parts

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$3.805

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$3.805

3,953

$3.964

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$3.805

AZTECH Wire

Italy . 328 parts In-Stock

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$12.291

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328

$12.291

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Parana Technologies

USA . 874 parts In-Stock

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$13.880

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$14.359

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874

$13.880

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$14.359

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DigiPath Technology Company

USA . 1,927 parts In-Stock

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$15.284

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$14.061

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1,927

$15.284

$14.061

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IDEA Electronic Components Group

UK . 2,193 parts In-Stock

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$15.596

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$14.816

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$14.036

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2,193

$15.596

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$14.036

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ChromeModa Solutions

Germany . 2,126 parts In-Stock

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$15.596

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$12.789

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2,126

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$12.789

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One Stop Electronics

USA . 1,566 parts In-Stock

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$55.000

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Microchip USA

USA . 2,760 parts In-Stock

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2,760

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Corphita

USA . 504 parts In-Stock

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Overview

Enhance the performance of your electronics with Texas Instruments' SN74ALS640BDWRE4 Bus Driver & Transceivers. Built with top-notch quality and cutting-edge technology, this product offers reliable signal transmission and seamless integration for a wide range of applications. With its compact design and efficient power consumption, customers can expect unparalleled value and performance. Upgrade your devices today with the SN74ALS640BDWRE4 and experience the difference in quality and reliability that Texas Instruments is known for.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package of this product lightweight and durable, ideal for use in transportation applications.

Propagation Delay At Nominal Supply: 11 ns

Low propagation delay ensures quick response time, making this product suitable for high-speed data transmission in bus driver applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving space and facilitating mass production.

No. of Bits: 8

8-bit configuration provides sufficient data capacity for bus driver and transceiver functions, allowing for versatile and flexible operation.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage ensures compatibility with most electronic systems, making this product a versatile choice for various applications.

Output Characteristics: 3-STATE

3-STATE output characteristics enable multiple devices to share a common bus line without interference, enhancing the efficiency of data transmission in complex systems.

Technology: TTL

TTL technology offers high-speed performance and reliable operation, making this product a dependable choice for bus driver and transceiver applications.

Technical Specifications

Bus Driver & Transceivers SN74ALS640BDWRE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH DIRECTION CONTROL

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

ALS

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

55 mA

Propagation Delay At Nominal Supply:

11 ns

Propagation Delay (tpd):

10 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Width:

7.5 mm

Trade Compliance

SN74ALS640BDWRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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