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SN74ALS245ADB

Texas Instruments

SN74ALS245ADB by Texas Instruments

SN74ALS245ADB by Texas Instruments is an 8-function bus driver with a propagation delay of 10ns. It operates at a supply voltage range of 4.5V to 5.5V and has a temperature range of 0°C to 70°C. This TTL technology transceiver is ideal for applications requiring fast signal transmission in commercial-grade environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 5,740 parts In-Stock

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5,740

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Standard Data Resources

USA . 117,610 parts In-Stock

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117,610

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Chip Stock

USA . 20,276 parts In-Stock

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20,276

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Vyrian

USA . 5,446 parts In-Stock

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5,446

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Digiode

USA . 187 parts In-Stock

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187

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LWI Electronics Inc

India . 3 parts In-Stock

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3

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Andel Nordic

Denmark . 2,339 parts In-Stock

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$8.299

100+ parts

-

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$7.967

10k+ parts

$7.967

2,339

$8.299

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$7.967

$7.967

Parana Technologies

USA . 2,195 parts In-Stock

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$9.153

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$9.799

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2,195

$9.153

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$9.799

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DigiPath Technology Company

USA . 345 parts In-Stock

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$10.078

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$9.272

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345

$10.078

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ChromeModa Solutions

Germany . 5,368 parts In-Stock

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$10.284

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$8.433

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$10.284

$8.433

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IDEA Electronic Components Group

UK . 230 parts In-Stock

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$10.284

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$9.770

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$9.256

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230

$10.284

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$9.256

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AZTECH Wire

Italy . 673 parts In-Stock

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$18.990

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673

$18.990

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Lixinc

USA . 7,128 parts In-Stock

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Microchip USA

USA . 1,731 parts In-Stock

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Kepictronics

USA . 706 parts In-Stock

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706

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Corphita

USA . 201 parts In-Stock

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201

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Overview

Upgrade your electronics projects with the SN74ALS245ADB by Texas Instruments. This high-quality bus driver & transceiver offers reliable performance and precision engineering. With Texas Instruments' reputation for excellence, you can trust that this product will meet your needs. Perfect for applications requiring fast signal transmission, this compact device provides 8 functions in a small outline package. Experience the value and benefits of seamless data transfer with the SN74ALS245ADB - elevate your projects to the next level with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Offers a lightweight and durable design for the product.

Surface Mount: YES

Facilitates easy integration and installation on circuit boards.

No. of Functions: 8

Provides multiple functions in a single compact device.

Nominal Supply Voltage / Vsup (V): 5

Operates at a common and stable supply voltage.

Propagation Delay (tpd): 10 ns

Ensures fast signal transmission and processing.

Output Characteristics: 3-STATE

Allows for high impedance output state, adding flexibility to the system.

Temperature Grade: COMMERCIAL

Suitable for use in standard commercial environments.

Technology: TTL

Utilizes TTL technology known for its reliability and simplicity.

Technical Specifications

Bus Driver & Transceivers SN74ALS245ADB attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Family:

ALS

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

7.2 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

8

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

10 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.3 mm

Trade Compliance

SN74ALS245ADB Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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