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SN74AHCT240NSRE4

Texas Instruments

SN74AHCT240NSRE4 by Texas Instruments

SN74AHCT240NSRE4 by Texas Instruments is a 20-terminal CMOS bus driver with 9.5 ns propagation delay, suitable for automotive applications. It features 3-STATE output characteristics, operates at a supply voltage of 5V, and has a max operating temperature of 125°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,207 parts In-Stock

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Digiode

USA . 3,457 parts In-Stock

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3,457

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Distributors (Availability)

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Andel Nordic

Denmark . 2,582 parts In-Stock

1+ parts

$1.490

100+ parts

-

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$1.430

10k+ parts

$1.430

2,582

$1.490

-

$1.430

$1.430

AZTECH Wire

Italy . 512 parts In-Stock

1+ parts

$19.790

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512

$19.790

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Ampacity Inc.

Singapore . 1,639 parts In-Stock

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$20.000

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1,639

$20.000

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Parana Technologies

USA . 1,330 parts In-Stock

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$30.078

100+ parts

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$66.819

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1,330

$30.078

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$66.819

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DigiPath Technology Company

USA . 1,049 parts In-Stock

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$33.120

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1,049

$33.120

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ChromeModa Solutions

Germany . 1,949 parts In-Stock

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$33.796

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$27.713

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1,949

$33.796

$27.713

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IDEA Electronic Components Group

UK . 833 parts In-Stock

1+ parts

$33.796

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$32.106

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$30.416

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833

$33.796

$32.106

$30.416

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One Stop Electronics

USA . 1,330 parts In-Stock

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$39.000

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1,330

$39.000

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Corphita

USA . 3,776 parts In-Stock

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3,776

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Microchip USA

USA . 1,421 parts In-Stock

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Overview

Unlock seamless communication with the SN74AHCT240NSRE4 from Texas Instruments. Crafted with precision and quality, this bus driver and transceiver offers unparalleled performance in a compact package. Perfect for automotive applications, this device provides reliable signal transmission with minimal delay, ensuring optimal efficiency in your projects. Experience the value of Texas Instruments' expertise and innovation with the SN74AHCT240NSRE4, the ultimate solution for your connectivity needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ensuring it can withstand rough handling and environmental conditions.

Propagation Delay At Nominal Supply: 9.5 ns

The fast propagation delay ensures quick signal transmission, making this product suitable for applications requiring high-speed data transfer.

Surface Mount: YES

Being surface mountable makes installation and replacement of the product easy and efficient, saving time and effort during assembly.

No. of Functions: 2

Having multiple functions in one component simplifies circuit design and reduces the need for additional components, saving space and cost.

Nominal Supply Voltage / Vsup (V): 5

This standard voltage requirement ensures compatibility with most common power supplies, making integration into existing systems seamless.

Output Characteristics: 3-STATE

The 3-STATE output allows for multiple devices to share the same bus without interference, enhancing the versatility and flexibility of the product.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions, making it suitable for automotive and industrial applications.

Technology: CMOS

The CMOS technology used in this product offers low power consumption and high noise immunity, ensuring reliable performance in various operating conditions.

Technical Specifications

Bus Driver & Transceivers SN74AHCT240NSRE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

AHCT/VHCT/VT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.6 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

.04 mA

Propagation Delay At Nominal Supply:

9.5 ns

Propagation Delay (tpd):

9.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5.3 mm

Trade Compliance

SN74AHCT240NSRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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