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SN74AHCT00NSRG4

Texas Instruments

SN74AHCT00NSRG4 by Texas Instruments

SN74AHCT00NSRG4 by Texas Instruments is a CMOS logic gate with 4 functions and 2 inputs. It operates at a supply voltage of 5V, has a propagation delay of 9ns, and can handle a load capacitance of 50pF. This industrial-grade component is ideal for applications requiring fast signal processing in temperature-sensitive environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,610 parts In-Stock

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5,610

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Digiode

USA . 3,308 parts In-Stock

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3,308

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Distributors (Availability)

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AZTECH Wire

Italy . 422 parts In-Stock

1+ parts

$12.578

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422

$12.578

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Parana Technologies

USA . 750 parts In-Stock

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$15.674

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$16.043

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750

$15.674

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$16.043

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DigiPath Technology Company

USA . 2,314 parts In-Stock

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$17.259

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2,314

$17.259

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ChromeModa Solutions

Germany . 3,613 parts In-Stock

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$17.611

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$14.441

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3,613

$17.611

$14.441

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IDEA Electronic Components Group

UK . 1,139 parts In-Stock

1+ parts

$17.611

100+ parts

$16.730

1k+ parts

$15.850

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1,139

$17.611

$16.730

$15.850

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One Stop Electronics

USA . 1,636 parts In-Stock

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$28.000

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1,636

$28.000

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Corphita

USA . 3,771 parts In-Stock

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Microchip USA

USA . 1,746 parts In-Stock

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Overview

Elevate your electronic projects with the SN74AHCT00NSRG4 by Texas Instruments. Crafted with precision and expertise, this logic gate offers unparalleled performance and reliability. With a wide range of applications in various industries, this product provides seamless integration and operation. Experience the value and benefits of this top-of-the-line component, designed to meet your every need. Trust in Texas Instruments for quality, innovation, and excellence in every detail. Choose the SN74AHCT00NSRG4 for unmatched efficiency and results in your projects.

Feature Benefit Bullets

Propagation Delay at Nominal Supply: 9 ns

Low propagation delay ensures fast and efficient signal processing.

No. of Functions: 4

Having multiple functions in a single device increases versatility and reduces the need for additional components.

Nominal Supply Voltage (Vsup): 5V

Standard supply voltage ensures compatibility with most circuits and power sources.

Maximum Operating Temperature: 85°C

High operating temperature range allows for use in various environments without performance degradation.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making the product efficient and reliable.

Technical Specifications

Logic Gates SN74AHCT00NSRG4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

AHCT/VHCT/VT

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

10.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

.02 mA

Propagation Delay At Nominal Supply:

9 ns

Propagation Delay (tpd):

9 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5.3 mm

Trade Compliance

SN74AHCT00NSRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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