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SN74AHC574PWRE4

Texas Instruments

SN74AHC574PWRE4 by Texas Instruments

SN74AHC574PWRE4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 12 ns and operates at a supply voltage of 3.3V. It features a small outline package, true output polarity, and is ideal for automotive applications requiring high-frequency operation up to 75 MHz.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Chip Stock

USA . 68,270 parts In-Stock

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Vyrian

USA . 6,968 parts In-Stock

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Digiode

USA . 2,920 parts In-Stock

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Prism Electronics

USA . 70 parts In-Stock

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Andel Nordic

Denmark . 5,434 parts In-Stock

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$1.230

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$1.180

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$1.180

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$1.180

AZTECH Wire

Italy . 332 parts In-Stock

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$13.572

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Parana Technologies

USA . 1,229 parts In-Stock

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$26.263

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$26.856

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DigiPath Technology Company

USA . 1,827 parts In-Stock

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$28.919

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$28.919

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ChromeModa Solutions

Germany . 4,946 parts In-Stock

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$29.509

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$24.197

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IDEA Electronic Components Group

UK . 837 parts In-Stock

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$29.509

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$28.034

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$26.558

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837

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One Stop Electronics

USA . 1,148 parts In-Stock

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$61.000

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Corphita

USA . 4,679 parts In-Stock

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Microchip USA

USA . 1,827 parts In-Stock

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Overview

Unlocking a world of seamless data transmission and communication, the SN74AHC574PWRE4 by Texas Instruments is a game-changer in the realm of Bus Driver & Transceivers. With a commitment to excellence and innovation, Texas Instruments delivers a product that boasts unparalleled quality and reliability. Whether it's in automotive applications or industrial settings, this high-performance device offers customers a competitive edge with its lightning-fast propagation delay and 3-state output characteristics. Elevate your projects with the SN74AHC574PWRE4 and experience the unmatched value and efficiency it brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and durable, ideal for use in automotive applications where weight and reliability are crucial.

Propagation Delay At Nominal Supply: 12 ns

The low propagation delay ensures fast signal transmission, making this bus driver suitable for high-speed communication systems.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on circuit boards, saving space and making the overall design more compact.

Nominal Supply Voltage / Vsup (V): 3.3

The 3.3V supply voltage is common and easily available, making it convenient to integrate this bus driver into existing systems.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature makes this bus driver suitable for automotive applications where the temperature can vary widely, ensuring reliable performance in harsh environments.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, making this bus driver energy-efficient and reliable for use in automotive communication systems.

Technical Specifications

Bus Driver & Transceivers SN74AHC574PWRE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

75000000 Hz

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Maximum Power Supply Current (ICC):

.04 mA

Propagation Delay At Nominal Supply:

12 ns

Propagation Delay (tpd):

19 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

4.4 mm

Trade Compliance

SN74AHC574PWRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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