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SN74ACT8847-40GA

Texas Instruments

SN74ACT8847-40GA by Texas Instruments

SN74ACT8847-40GA by Texas Instruments is a 32-bit math coprocessor with 5V supply, operating at up to 25MHz. It features a ceramic package, 208 terminals in grid array style, and boundary scan support. Ideal for commercial applications requiring high-speed mathematical processing capabilities.

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Lifecycle Status

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Digiode

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Vyrian

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Sinequanon

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J & M Industries LLC

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AZTECH Wire

Italy . 328 parts In-Stock

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One Stop Electronics

USA . 986 parts In-Stock

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Corohmni

South Africa . 2,367 parts In-Stock

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Parana Technologies

USA . 2,278 parts In-Stock

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DigiPath Technology Company

USA . 161 parts In-Stock

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ChromeModa Solutions

Germany . 6,280 parts In-Stock

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IDEA Electronic Components Group

UK . 1,142 parts In-Stock

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Corphita

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Perfect Parts

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Overview

Elevate your electronic designs with the SN74ACT8847-40GA by Texas Instruments, a top-tier manufacturer known for quality and innovation. As a powerful Math CoProcessor, this product offers unparalleled performance and reliability for a wide range of applications. With a maximum clock frequency of 25 MHz and 32-bit external data bus width, this device provides seamless integration and high-speed processing capabilities. Experience the value and benefits of this cutting-edge technology, designed to optimize efficiency and enhance functionality in your projects.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package body material provides excellent thermal conductivity and high mechanical strength, ensuring durability and efficient heat dissipation.

Maximum Supply Voltage: 5.25 V

Allows for higher voltage input, which can result in improved performance and processing capabilities.

Address Bus Width: 32

32-bit address bus width allows for processing large amounts of data quickly and efficiently.

Package Shape: SQUARE

Square package shape is compact and allows for easy integration into various system designs.

Power Supplies (V): 5

Standard power supply voltage ensures compatibility with most systems and devices.

No. of Terminals: 208

Higher number of terminals provide more connectivity options and flexibility for integration.

Package Style (Meter): GRID ARRAY

Grid array package style offers better electrical performance and reliability in complex electronic systems.

Minimum Supply Voltage: 4.75 V

Allows for stable operation at lower voltage levels, enhancing power efficiency.

Maximum Operating Temperature: 70 °C

Wide operating temperature range ensures reliable performance in various environmental conditions.

Minimum Operating Temperature: 0 °C

Can operate effectively in low-temperature environments without compromising performance.

Terminal Position: PERPENDICULAR

Perpendicular terminal position facilitates easy connections and secure contact with other components.

Boundary Scan: YES

Boundary scan capability allows for efficient testing and debugging of the device during production and operation.

External Data Bus Width: 32

Matching the address bus width, the 32-bit external data bus means seamless data transfer and processing.

Maximum Clock Frequency: 25 MHz

High maximum clock frequency enables fast data processing speeds and higher performance.

Temperature Grade: COMMERCIAL

Suitable for use in standard commercial applications where temperature fluctuations are moderate.

Peripheral IC Type: MATH PROCESSOR, COPROCESSOR

Designed specifically for mathematical operations, making it an ideal choice for applications requiring complex calculations.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and reliable performance.

Terminal Form: PIN/PEG

Pin/peg terminal form provides secure connections and easy integration into circuitry.

Maximum Supply Current: 0.2 mA

Low maximum supply current results in energy-efficient operation and reduced power consumption.

Nominal Supply Voltage: 5 V

The nominal supply voltage ensures stable and consistent power delivery for reliable performance.

Terminal Pitch: 2.54 mm

Standard terminal pitch allows for compatibility with common socket and connector options for easy installation.

Technical Specifications

Math CoProcessors SN74ACT8847-40GA attributes and parameters. Explore more Math CoProcessors devices from Texas Instruments

Specs

Address Bus Width:

32

Boundary Scan:

YES

Maximum Clock Frequency:

25 MHz

External Data Bus Width:

32

JESD-30 Code:

S-XPGA-P208

No. of Terminals:

208

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

PGA

Package Equivalence Code:

PGA208,17X17

Package Shape:

Package Style (Meter):

GRID ARRAY

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Math Processors

Maximum Supply Current:

.2 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

PERPENDICULAR

Peripheral IC Type:

Trade Compliance

SN74ACT8847-40GA Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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