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TMS390C602A-33GA

Texas Instruments

TMS390C602A-33GA by Texas Instruments

TMS390C602A-33GA by Texas Instruments is a Math CoProcessor with 32-bit Address Bus, 5V Power Supply, and 33MHz Clock Frequency. Ideal for commercial applications requiring high-speed mathematical processing capabilities.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,600 parts In-Stock

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7,600

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Digiode

USA . 3,110 parts In-Stock

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3,110

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Distributors (Availability)

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AZTECH Wire

Italy . 296 parts In-Stock

1+ parts

$6.862

100+ parts

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296

$6.862

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One Stop Electronics

USA . 934 parts In-Stock

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$9.000

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934

$9.000

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Parana Technologies

USA . 1,813 parts In-Stock

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$69.990

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1,813

$69.990

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Corohmni

South Africa . 1,918 parts In-Stock

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$72.919

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1,918

$72.919

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DigiPath Technology Company

USA . 1,482 parts In-Stock

1+ parts

$77.068

100+ parts

$70.903

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1,482

$77.068

$70.903

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ChromeModa Solutions

Germany . 2,580 parts In-Stock

1+ parts

$78.641

100+ parts

$64.486

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2,580

$78.641

$64.486

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IDEA Electronic Components Group

UK . 1,366 parts In-Stock

1+ parts

$78.641

100+ parts

$74.709

1k+ parts

$70.777

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1,366

$78.641

$74.709

$70.777

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Corphita

USA . 4,784 parts In-Stock

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4,784

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Overview

Enhance your electronic devices with the TMS390C602A-33GA by Texas Instruments, a top-quality Math Coprocessor that delivers unparalleled performance and efficiency. With Texas Instruments' reputation for excellence in semiconductor manufacturing, this product guarantees reliability and precision in various applications. Whether you're developing cutting-edge technology or upgrading existing systems, the TMS390C602A-33GA offers superior value, benefits, and advantages that will elevate your projects to new heights. Choose the best, choose Texas Instruments.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages provide excellent thermal conductivity and reliability, making the product highly durable and resistant to temperature fluctuations.

Maximum Supply Voltage: 5.25 V

The product can handle high supply voltage levels, ensuring stability and reliable performance in various operating conditions.

Address Bus Width: 32

With a wide address bus width of 32, the coprocessor can efficiently handle large volumes of data and complex mathematical operations.

Package Shape: SQUARE

The square package shape allows for easy integration and compact placement within electronic systems, optimizing space utilization.

Power Supplies (V): 5

Operating at a power supply of 5V ensures compatibility with standard electronic systems and promotes efficient power consumption.

No. of Terminals: 143

A higher number of terminals enable enhanced connectivity options and signal transmission capabilities for seamless data processing.

Package Style (Meter): GRID ARRAY

The grid array package style offers a robust mechanical setup and facilitates easy PCB mounting, ensuring secure placement and reliable connections.

Minimum Supply Voltage: 4.75 V

The coprocessor can operate at lower supply voltage levels, providing flexibility and compatibility with a variety of power sources.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, the coprocessor can function reliably in demanding thermal environments without compromising performance.

Minimum Operating Temperature: 0 °C

The coprocessor can operate effectively at low temperatures, ensuring consistent performance in different climatic conditions.

Terminal Position: PERPENDICULAR

Perpendicular terminal positioning enables secure connections and easy access for installation and maintenance purposes, promoting overall system reliability.

Boundary Scan: YES

Having boundary scan capability allows for efficient testing and debugging of the coprocessor's functionality, ensuring high quality and reliability.

External Data Bus Width: 32

A wide external data bus width of 32 enhances data transfer speeds and processing efficiency, making the coprocessor ideal for complex mathematical computations.

Maximum Clock Frequency: 33 MHz

Operating at a maximum clock frequency of 33 MHz enables high-speed data processing and real-time operation, enhancing overall system performance.

Temperature Grade: COMMERCIAL

Designed for commercial applications, the coprocessor meets industry standards for temperature performance and reliability in typical operating environments.

Peripheral IC Type: MATH PROCESSOR, COPROCESSOR

As a specialized math processor coprocessor, the product offers dedicated mathematical processing capabilities, making it highly efficient for math-intensive tasks.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption, high reliability, and compatibility with modern electronic systems, making the coprocessor a cost-effective choice.

Terminal Form: PIN/PEG

The pin/peg terminal form provides secure connectivity and easy installation, allowing for hassle-free integration within electronic systems.

Maximum Supply Current: 1 mA

Operating at a maximum supply current of 1mA indicates efficient power usage and low energy consumption, contributing to overall system efficiency.

Nominal Supply Voltage: 5 V

Having a nominal supply voltage of 5V ensures stable and consistent power delivery, promoting reliable performance in various operational scenarios.

Terminal Pitch: 2.54 mm

With a terminal pitch of 2.54mm, the coprocessor offers compatibility with standard electronic interfaces and facilitates easy integration into existing systems.

Technical Specifications

Math CoProcessors TMS390C602A-33GA attributes and parameters. Explore more Math CoProcessors devices from Texas Instruments

Specs

Address Bus Width:

32

Boundary Scan:

YES

Maximum Clock Frequency:

33 MHz

External Data Bus Width:

32

JESD-30 Code:

S-XPGA-P143

No. of Terminals:

143

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

PGA

Package Equivalence Code:

PGA143,15X15

Package Shape:

Package Style (Meter):

GRID ARRAY

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Math Processors

Maximum Supply Current:

1 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

PERPENDICULAR

Peripheral IC Type:

Trade Compliance

TMS390C602A-33GA Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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