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SN74ACT8837GB

Texas Instruments

SN74ACT8837GB by Texas Instruments

SN74ACT8837GB by Texas Instruments is a Math CoProcessor with 32-bit external data bus width, operating at 5V. It features a ceramic package body material, 208 terminals in a grid array style, and supports boundary scan. Ideal for commercial applications requiring high-speed mathematical processing capabilities.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,077 parts In-Stock

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Digiode

USA . 1,804 parts In-Stock

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A2Z Electronics, Inc.

USA . 44 parts In-Stock

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Bristol Electronics

USA . 44 parts In-Stock

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44

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AZTECH Wire

Italy . 724 parts In-Stock

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$16.123

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One Stop Electronics

USA . 1,026 parts In-Stock

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$17.000

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Corohmni

South Africa . 5,166 parts In-Stock

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$48.310

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Parana Technologies

USA . 873 parts In-Stock

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DigiPath Technology Company

USA . 637 parts In-Stock

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$59.585

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IDEA Electronic Components Group

UK . 505 parts In-Stock

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$60.801

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$57.761

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$54.721

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505

$60.801

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ChromeModa Solutions

Germany . 77 parts In-Stock

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$60.801

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$49.857

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Corphita

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Overview

Experience unparalleled performance and reliability with the SN74ACT8837GB by Texas Instruments. As a leader in semiconductor manufacturing, Texas Instruments delivers cutting-edge Math CoProcessors that are perfect for a wide range of applications. From enhancing computational capabilities to improving overall system efficiency, this product offers exceptional value and benefits to customers looking to elevate their technology solutions. Trust Texas Instruments to provide top-of-the-line products that exceed expectations and deliver superior results every time.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package body material provides good thermal conductivity, ensuring efficient heat dissipation and thereby enhancing the overall performance and durability of the Math CoProcessor.

Maximum Supply Voltage: 5.25 V

Higher maximum supply voltage allows for flexibility in power supply options and compatibility with different systems, making this Math CoProcessor suitable for a wide range of applications.

Package Shape: SQUARE

Square package shape allows for easy integration and mounting in various orientations, maximizing installation flexibility and space efficiency in system designs.

Power Supplies (V): 5

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources, making this Math CoProcessor easy to integrate into existing systems without the need for additional power regulation.

No. of Terminals: 208

Higher number of terminals provide enhanced connectivity and communication capabilities, allowing for efficient data transfer and processing within the Math CoProcessor.

Package Style (Meter): GRID ARRAY

Grid array package style facilitates soldering and PCB mounting processes, ensuring a secure and reliable connection between the Math CoProcessor and the system board.

Minimum Supply Voltage: 4.75 V

Lower minimum supply voltage helps in optimizing power consumption and improving energy efficiency, making this Math CoProcessor a cost-effective choice for power-sensitive applications.

Maximum Operating Temperature: 70 °C

High maximum operating temperature tolerance ensures reliable performance in harsh environmental conditions, making this Math CoProcessor suitable for industrial and automotive applications requiring extended temperature range support.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature tolerance enables operation in cold environments without compromising performance, enhancing the versatility and reliability of this Math CoProcessor.

Terminal Position: PERPENDICULAR

Perpendicular terminal position simplifies connection and installation processes, facilitating ease of integration and maintenance in system designs utilizing this Math CoProcessor.

Boundary Scan: YES

Boundary scan support enables efficient debugging and testing of the Math CoProcessor during production and development stages, ensuring high quality and reliability of the final product.

External Data Bus Width: 32

Wider external data bus width of 32 bits enhances data processing speed and efficiency, enabling faster calculations and improved overall performance of the Math CoProcessor in computational tasks.

Temperature Grade: COMMERCIAL

Commercial temperature grade certification ensures compatibility with standard operating conditions, making this Math CoProcessor suitable for general-purpose computing applications in commercial environments.

Peripheral IC Type: MATH PROCESSOR, COPROCESSOR

Peripheral IC type designation as a Math Processor and Coprocessor indicates specialized mathematical processing capabilities, enhancing the performance and usability of this product in mathematical computations and algorithms.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this Math CoProcessor energy-efficient and reliable in data processing applications requiring stable and accurate performance.

Terminal Form: PIN/PEG

Pin/peg terminal form provides secure and reliable connections for data transfer and communication, ensuring stable operation and seamless integration of the Math CoProcessor in various system architectures.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V ensures stable and efficient power delivery to the Math CoProcessor, supporting reliable performance and consistent operation in diverse computing applications.

Terminal Pitch: 2.54 mm

Terminal pitch of 2.54mm allows for easy connection and compatibility with standard PCB layouts, enabling seamless integration of the Math CoProcessor into existing system designs without the need for additional modifications.

Technical Specifications

Math CoProcessors SN74ACT8837GB attributes and parameters. Explore more Math CoProcessors devices from Texas Instruments

Specs

Address Bus Width:

0

Boundary Scan:

YES

External Data Bus Width:

32

JESD-30 Code:

S-XPGA-P208

No. of Terminals:

208

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

PGA

Package Equivalence Code:

PGA208,17X17

Package Shape:

Package Style (Meter):

GRID ARRAY

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Math Processors

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

PERPENDICULAR

Peripheral IC Type:

Trade Compliance

SN74ACT8837GB Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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