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STFLWARP11/PL

STMicroelectronics

STFLWARP11/PL by STMicroelectronics

STFLWARP11/PL by STMicroelectronics is a math coprocessor designed for fuzzy computation acceleration. It operates at 5V with a max clock frequency of 40 MHz, featuring an address bus width of 10. Ideal for applications requiring efficient data processing in compact systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,675 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

3,675

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-

-

-

Digiode

USA . 2,401 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,401

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-

-

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Anansix

USA . 1,795 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

1,795

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 1,115 parts In-Stock

1+ parts

$31.803

100+ parts

-

1k+ parts

-

10k+ parts

-

1,115

$31.803

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-

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IDEA Electronic Components Group

UK . 1,114 parts In-Stock

1+ parts

$69.431

100+ parts

-

1k+ parts

$62.488

10k+ parts

-

1,114

$69.431

-

$62.488

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MKK Technologies

India . 2,108 parts In-Stock

1+ parts

$130.560

100+ parts

-

1k+ parts

-

10k+ parts

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2,108

$130.560

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-

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DigiPath Technology Company

USA . 2,108 parts In-Stock

1+ parts

$130.560

100+ parts

-

1k+ parts

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10k+ parts

-

2,108

$130.560

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-

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Corphita

USA . 1,010 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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1,010

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Parana Technologies

USA . 935 parts In-Stock

1+ parts

-

100+ parts

$83.015

1k+ parts

-

10k+ parts

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935

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$83.015

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Overview

Unlock unparalleled performance with the STFLWARP11/PL from STMicroelectronics, a pinnacle in math coprocessors designed to elevate your applications. Renowned for precision and reliability, this powerhouse ensures seamless fuzzy computation acceleration, enabling rapid data processing for complex tasks. With its robust design and versatile compatibility, it empowers engineers to innovate effortlessly, delivering unmatched efficiency and value that drives success in diverse projects. Embrace the future of computing today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures durability and resistance to environmental factors, making it reliable for various applications.

Surface Mount: YES

Surface mount technology allows for a smaller footprint on PCBs, enabling more compact designs which are essential in modern electronics.

Maximum Supply Voltage: 5.25 V

A maximum supply voltage of 5.25 V provides flexibility for integration into different systems without the risk of overvoltage damage.

Address Bus Width: 10

The 10-bit address bus width enables the processor to access a larger address space, allowing for more memory and enhanced computational capabilities.

Package Shape: SQUARE

The square package shape facilitates easier PCB layout and optimized space utilization within electronic designs.

Power Supplies (V): 5

Operating at a standard power supply of 5 V ensures compatibility with a wide range of power sources and simplifies integration.

No. of Terminals: 84

With 84 terminals, this processor can support multiple connections for data, power, and control, enhancing versatility in applications.

Package Style (Meter): CHIP CARRIER

The chip carrier package style enhances thermal management and allows for better performance in high-speed applications.

Minimum Supply Voltage: 4.75 V

A minimum supply voltage requirement of 4.75 V ensures that the processor operates reliably under a range of supply conditions.

Maximum Operating Temperature: 70 °C

The ability to operate at up to 70 °C makes this processor suitable for use in various environments, including those with moderate heat.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0 °C, this product can function in a wider range of climates, enhancing its flexibility.

Terminal Finish: TIN LEAD

TIN LEAD finish provides excellent solderability and ensures reliable connections during assembly and operation.

Terminal Position: QUAD

Quad terminal positioning allows for efficient routing on PCBs, important for maintaining signal integrity in high-speed applications.

Maximum Seated Height: 5.08 mm

The compact seated height of 5.08 mm is advantageous for space-constrained applications, allowing for denser component assembly.

Width: 29.305 mm

A width of 29.305 mm ensures compatibility with standard PCB designs while maintaining optimal spacing for heat dissipation.

External Data Bus Width: 8

An 8-bit external data bus width balances performance with simplicity, making it suitable for various applications including embedded systems.

Maximum Clock Frequency: 40 MHz

The 40 MHz maximum clock frequency allows for fast computation speeds, making it ideal for applications requiring high-performance processing.

Length: 29.305 mm

A length of 29.305 mm complements the width for a uniform square shape, facilitating standardized mounting and ease of design.

Temperature Grade: COMMERCIAL

Rated for commercial temperatures, this product is designed for everyday applications, ensuring reliability in typical operating conditions.

Peripheral IC Type: MATH PROCESSOR, FUZZY COMPUTATION ACCELERATOR

Being a math processor with fuzzy computation capabilities makes this product highly suitable for applications in artificial intelligence and complex calculations.

Technology: HCMOS

HCMOS technology provides low power consumption and high speed, making this processor efficient and effective for modern applications.

Terminal Form: J BEND

J BEND terminals facilitate easier assembly and provide robust mechanical support during the soldering process.

Nominal Supply Voltage: 5 V

A nominal voltage of 5 V means easy integration into existing circuits without the need for additional voltage regulation.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch balances between ease of soldering and compactness, making it suitable for dense PCB layouts.

Technical Specifications

Math CoProcessors STFLWARP11/PL attributes and parameters. Explore more Math CoProcessors devices from STMicroelectronics

Specs

Address Bus Width:

10

Boundary Scan:

NO

Maximum Clock Frequency:

40 MHz

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J84

JESD-609 Code:

e0

Length:

29.305 mm

No. of Terminals:

84

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC84,1.2SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Math Processors

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

HCMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

29.305 mm

Trade Compliance

STFLWARP11/PL Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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