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TMX34082AGC-40

Texas Instruments

TMX34082AGC-40 by Texas Instruments

TMX34082AGC-40 by Texas Instruments is a Math CoProcessor with 32-bit Address Bus Width, 5V Power Supplies, and 40 MHz Max Clock Frequency. It is used in commercial applications requiring high-speed mathematical processing capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,785 parts In-Stock

1+ parts

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8,785

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Digiode

USA . 110 parts In-Stock

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110

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,061 parts In-Stock

1+ parts

$15.000

100+ parts

-

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1,061

$15.000

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AZTECH Wire

Italy . 369 parts In-Stock

1+ parts

$15.354

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369

$15.354

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Corohmni

South Africa . 1,020 parts In-Stock

1+ parts

$46.501

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1,020

$46.501

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Parana Technologies

USA . 1,581 parts In-Stock

1+ parts

$53.321

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1,581

$53.321

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ChromeModa Solutions

Germany . 2,243 parts In-Stock

1+ parts

$59.911

100+ parts

$49.127

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2,243

$59.911

$49.127

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IDEA Electronic Components Group

UK . 249 parts In-Stock

1+ parts

$59.911

100+ parts

$56.915

1k+ parts

$53.920

10k+ parts

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249

$59.911

$56.915

$53.920

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Corphita

USA . 3,638 parts In-Stock

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3,638

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DigiPath Technology Company

USA . 1,216 parts In-Stock

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$54.016

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1,216

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$54.016

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Overview

Enhance your products with the TMX34082AGC-40 by Texas Instruments, a high-quality Math CoProcessor that delivers unmatched performance and reliability. With Texas Instruments' reputation for excellence in semiconductor manufacturing, you can trust this product to provide seamless integration and exceptional results in a wide range of applications. From enhancing computational capabilities to optimizing data processing, this COPROCESSOR offers incredible value, benefits, and advantages to customers looking to elevate their technology solutions. Experience the difference with the TMX34082AGC-40 today!

Feature Benefit Bullets

Package Body Material: CERAMIC

The use of ceramic material provides durability and excellent heat dissipation, making this math coprocessor reliable for long hours of operation.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this math coprocessor can handle power fluctuations and ensure stable performance.

Address Bus Width: 32

A wider address bus width allows for faster data transfer and processing capabilities, making this coprocessor suitable for complex mathematical computations.

Maximum Operating Temperature: 70 °C

The coprocessor can operate efficiently even in high-temperature environments, ensuring consistent performance under varying conditions.

Maximum Clock Frequency: 40 MHz

With a high maximum clock frequency, this coprocessor can handle complex calculations quickly, making it ideal for demanding mathematical tasks.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this coprocessor energy-efficient and reliable for extended use.

Technical Specifications

Math CoProcessors TMX34082AGC-40 attributes and parameters. Explore more Math CoProcessors devices from Texas Instruments

Specs

Address Bus Width:

32

Boundary Scan:

NO

Maximum Clock Frequency:

40 MHz

External Data Bus Width:

32

JESD-30 Code:

S-XPGA-P145

No. of Terminals:

145

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

PGA

Package Equivalence Code:

PGA145,15X15

Package Shape:

Package Style (Meter):

GRID ARRAY

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Math Processors

Maximum Supply Current:

250 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

PERPENDICULAR

Peripheral IC Type:

Trade Compliance

TMX34082AGC-40 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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