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STFLWARP11/PG

STMicroelectronics

STFLWARP11/PG by STMicroelectronics

STFLWARP11/PG from STMicroelectronics is a math coprocessor designed for fuzzy computation acceleration. It operates at a max voltage of 5.25V, with a clock frequency up to 40 MHz and features a 10-bit address bus. Ideal for commercial applications requiring efficient data processing in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,851 parts In-Stock

1+ parts

-

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2,851

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Anansix

USA . 2,473 parts In-Stock

1+ parts

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1k+ parts

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2,473

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Digiode

USA . 1,736 parts In-Stock

1+ parts

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1,736

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 76 parts In-Stock

1+ parts

$22.560

100+ parts

-

1k+ parts

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76

$22.560

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IDEA Electronic Components Group

UK . 778 parts In-Stock

1+ parts

$55.666

100+ parts

-

1k+ parts

$50.100

10k+ parts

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778

$55.666

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$50.100

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MKK Technologies

India . 939 parts In-Stock

1+ parts

$104.677

100+ parts

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939

$104.677

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DigiPath Technology Company

USA . 939 parts In-Stock

1+ parts

$104.677

100+ parts

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939

$104.677

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Corphita

USA . 3,491 parts In-Stock

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3,491

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Parana Technologies

USA . 372 parts In-Stock

1+ parts

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$66.558

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372

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$66.558

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Overview

Unlock unparalleled performance with the STFLWARP11/PG from STMicroelectronics, a leader in cutting-edge technology. This advanced math coprocessor is expertly designed for precision and efficiency, making it ideal for applications in embedded systems and complex computations. With robust ceramic packaging and superior temperature handling, it ensures reliability in diverse environments. Elevate your projects with unmatched processing power and reap the benefits of enhanced productivity and innovation.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed co-fired construction provides excellent thermal and mechanical stability, ensuring reliable performance in various operating conditions.

Maximum Supply Voltage: 5.25 V

A maximum supply voltage of 5.25 V allows compatibility with a wide range of power supply systems, making it versatile for different applications.

Address Bus Width: 10

A 10-bit address bus width enables the processor to address a larger memory space, which is beneficial for complex mathematical computations.

Package Shape: SQUARE

The square shape of the package facilitates efficient layout and space optimization on circuit boards, contributing to better design flexibility.

Power Supplies (V): 5

Operating at a nominal supply voltage of 5 V is standard for many systems, simplifying integration into existing designs.

No. of Terminals: 100

With 100 terminals available, this coprocessor supports extensive connectivity options, enhancing its functionality and integration potential in complex systems.

Package Style (Meter): GRID ARRAY

The grid array package style ensures a compact arrangement and efficient heat dissipation, leading to improved performance and reliability.

Minimum Supply Voltage: 4.75 V

A minimum supply voltage of 4.75 V ensures that the coprocessor can function reliably in a variety of low-voltage environments.

Maximum Operating Temperature: 70 °C

An operating temperature limit of 70 °C makes this coprocessor suitable for commercial applications without significant thermal concerns.

Minimum Operating Temperature: 0 °C

The capability to operate at temperatures as low as 0 °C allows for broad application range in environments with varying thermal conditions.

Terminal Finish: TIN LEAD

The tin-lead terminal finish provides good solderability and corrosion resistance, ensuring a reliable connection in electronic assemblies.

Terminal Position: PERPENDICULAR

Perpendicular terminal positioning promotes efficient space utilization on PCBs while enhancing the robustness of connections.

Maximum Seated Height: 3.94 mm

The low seated height of 3.94 mm allows for a compact design that is ideal for space-constrained applications.

External Data Bus Width: 8

An 8-bit external data bus width allows for efficient data transfer, contributing to the overall processing speed of the coprocessor.

Maximum Clock Frequency: 40 MHz

A maximum clock frequency of 40 MHz enables high-speed computations, making it suitable for demanding mathematical tasks.

Temperature Grade: COMMERCIAL

With a commercial temperature grade, this coprocessor is designed for reliable performance in typical commercial environments.

Peripheral IC Type: MATH PROCESSOR, FUZZY COMPUTATION ACCELERATOR

Designed specifically for mathematical processing and fuzzy computations, this coprocessor excels in specialized tasks, enhancing computational efficiency.

Technology: HCMOS

Utilizing HCMOS technology offers low power consumption and high-speed performance, making this coprocessor efficient and responsive.

Terminal Form: PIN/PEG

The PIN/PEG terminal form provides flexible mounting options, simplifying integration into diverse circuit designs.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5 V aligns with industry standards, ensuring compatibility with many existing systems.

Terminal Pitch: 2.54 mm

A terminal pitch of 2.54 mm accommodates standard PCB design practices, facilitating easier manufacturing and assembly.

Technical Specifications

Math CoProcessors STFLWARP11/PG attributes and parameters. Explore more Math CoProcessors devices from STMicroelectronics

Specs

Address Bus Width:

10

Boundary Scan:

NO

Maximum Clock Frequency:

40 MHz

External Data Bus Width:

8

JESD-30 Code:

S-CPGA-P100

JESD-609 Code:

e0

No. of Terminals:

100

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

PGA

Package Equivalence Code:

PGA100M,13X13

Package Shape:

Package Style (Meter):

GRID ARRAY

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

3.94 mm

Sub-Category:

Math Processors

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

HCMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

PERPENDICULAR

Trade Compliance

STFLWARP11/PG Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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