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MC68882RC33

NXP Semiconductors

MC68882RC33 by NXP Semiconductors

MATH PROCESSOR, COPROCESSOR; Temperature Grade: COMMERCIAL; Terminal Form: PIN/PEG; No. of Terminals: 68; Package Code: PGA; Package Shape: SQUARE;

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,625 parts In-Stock

1+ parts

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3,625

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Anansix

USA . 2,808 parts In-Stock

1+ parts

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1k+ parts

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2,808

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Vyrian

USA . 1,246 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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1,246

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 3,117 parts In-Stock

1+ parts

$18.000

100+ parts

-

1k+ parts

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10k+ parts

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3,117

$18.000

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Corohmni

South Africa . 3,138 parts In-Stock

1+ parts

$48.415

100+ parts

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10k+ parts

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3,138

$48.415

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UNI Independent Distributors

Spain . 7,399 parts In-Stock

1+ parts

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7,399

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Corphita

USA . 1,985 parts In-Stock

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1,985

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Technical Specifications

Math CoProcessors MC68882RC33 attributes and parameters. Explore more Math CoProcessors devices from NXP Semiconductors

Specs

Address Bus Width:

5

Barrel Shifter:

YES

Boundary Scan:

NO

Bus Compatibility:

MC68882

Maximum Clock Frequency:

33.33 MHz

External Data Bus Width:

32

JESD-30 Code:

S-CPGA-P68

Length:

26.92 mm

No. of Terminals:

68

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

PGA

Package Equivalence Code:

PGA68,10X10

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

4.184 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

HCMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

PERPENDICULAR

Width:

26.92 mm

Peripheral IC Type:

Trade Compliance

MC68882RC33 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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