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SN74ACT8847-30GB

Texas Instruments

SN74ACT8847-30GB by Texas Instruments

SN74ACT8847-30GB by Texas Instruments is a Math CoProcessor with 32-bit Address Bus, operating at 33.33 MHz clock frequency. It has a max supply voltage of 5.25 V and is suitable for commercial applications requiring high-speed mathematical processing capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,749 parts In-Stock

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3,749

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Digiode

USA . 3,181 parts In-Stock

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3,181

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Distributors (Availability)

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AZTECH Wire

Italy . 448 parts In-Stock

1+ parts

$5.709

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448

$5.709

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One Stop Electronics

USA . 152 parts In-Stock

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$9.000

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152

$9.000

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Parana Technologies

USA . 1,733 parts In-Stock

1+ parts

$22.404

100+ parts

$2,080.548

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$20.164

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1,733

$22.404

$2,080.548

$20.164

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Corohmni

South Africa . 978 parts In-Stock

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$23.219

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978

$23.219

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DigiPath Technology Company

USA . 1,621 parts In-Stock

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$24.670

100+ parts

$22.696

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1,621

$24.670

$22.696

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ChromeModa Solutions

Germany . 5,275 parts In-Stock

1+ parts

$25.173

100+ parts

$20.642

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5,275

$25.173

$20.642

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IDEA Electronic Components Group

UK . 1,521 parts In-Stock

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$25.173

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$23.914

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$22.656

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1,521

$25.173

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Corphita

USA . 2,992 parts In-Stock

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Overview

Elevate your mathematical processing capabilities with the SN74ACT8847-30GB by Texas Instruments. This high-quality Math CoProcessor offers unparalleled performance and reliability, thanks to its cutting-edge technology and superior manufacturing standards. Ideal for a wide range of applications, this product provides exceptional value, efficiency, and precision to customers. Upgrade your system today with the SN74ACT8847-30GB and experience seamless mathematical computations like never before.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides good heat dissipation, ensuring the product operates efficiently even at high temperatures.

Maximum Supply Voltage: 5.25 V

Higher maximum supply voltage allows for flexibility in power requirements and compatibility with a range of systems.

Address Bus Width: 32

Wide address bus width enables the processor to handle complex mathematical calculations and data processing effectively.

Package Shape: SQUARE

Square package shape allows for easy integration and placement within circuit boards or systems.

Power Supplies (V): 5

Stable power supply at 5V ensures reliable performance and consistent operation of the coprocessor.

No. of Terminals: 208

Higher number of terminals provide ample connectivity options and compatibility with various systems.

Package Style (Meter): GRID ARRAY

Grid array package style offers efficient heat dissipation and allows for compact design, saving space in system layouts.

Maximum Operating Temperature: 70 °C

High maximum operating temperature range ensures the coprocessor functions optimally even in demanding environments.

Maximum Clock Frequency: 33.33 MHz

High maximum clock frequency enables fast processing speeds, making the coprocessor suitable for tasks requiring quick calculations.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the coprocessor.

Technical Specifications

Math CoProcessors SN74ACT8847-30GB attributes and parameters. Explore more Math CoProcessors devices from Texas Instruments

Specs

Address Bus Width:

32

Boundary Scan:

YES

Maximum Clock Frequency:

33.33 MHz

External Data Bus Width:

32

JESD-30 Code:

S-XPGA-P208

No. of Terminals:

208

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

PGA

Package Equivalence Code:

PGA208,17X17

Package Shape:

Package Style (Meter):

GRID ARRAY

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Math Processors

Maximum Supply Current:

.2 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

PERPENDICULAR

Peripheral IC Type:

Trade Compliance

SN74ACT8847-30GB Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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