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SN74ACT573DWRG4

Texas Instruments

SN74ACT573DWRG4 by Texas Instruments

SN74ACT573DWRG4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 12ns at 5V. It features a 3-STATE output and operates in industrial temperature range (-40 to 85°C). Ideal for applications requiring true output polarity control, such as data communication systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,169 parts In-Stock

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Digiode

USA . 781 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Semicontronic

India . 1,374 parts In-Stock

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$5.000

100+ parts

$4.875

1k+ parts

$4.850

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-

1,374

$5.000

$4.875

$4.850

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Andel Nordic

Denmark . 4,835 parts In-Stock

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$6.772

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$6.502

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$6.502

4,835

$6.772

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$6.502

$6.502

AZTECH Wire

Italy . 893 parts In-Stock

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$7.121

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Corohmni

South Africa . 11 parts In-Stock

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$11.596

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11

$11.596

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Parana Technologies

USA . 601 parts In-Stock

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$29.363

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$58.517

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601

$29.363

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$58.517

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DigiPath Technology Company

USA . 518 parts In-Stock

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$32.332

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$32.332

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ChromeModa Solutions

Germany . 3,541 parts In-Stock

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$32.992

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$27.053

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$32.992

$27.053

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IDEA Electronic Components Group

UK . 845 parts In-Stock

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$32.992

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$31.342

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$29.693

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845

$32.992

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$29.693

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Ampacity Inc.

Singapore . 1,180 parts In-Stock

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$51.000

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One Stop Electronics

USA . 877 parts In-Stock

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$58.000

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QUARKTWIN TECHNOLOGY LTD

USA . 17,930 parts In-Stock

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Corphita

USA . 4,985 parts In-Stock

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Argo Parts USA

USA . 3,814 parts In-Stock

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Continental Prestige Electronics

USA . 3,012 parts In-Stock

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Microchip USA

USA . 2,664 parts In-Stock

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Robosynatics

Brazil . 300 parts In-Stock

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Lucentia Tech

USA . 300 parts In-Stock

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Bastille Electronics

Australia . 40 parts In-Stock

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Overview

Elevate your electronic designs with the SN74ACT573DWRG4 by Texas Instruments, a top-tier manufacturer recognized for quality and reliability. As a leading product in the Bus Driver & Transceivers category, this 8-bit device offers seamless data transmission with a fast 12 ns propagation delay. With a compact rectangular package and surface-mount design, it's perfect for industrial applications requiring high-speed connectivity. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations, providing unparalleled value and performance to customers seeking premium electronic components.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the bus driver & transceiver.

Propagation Delay At Nominal Supply: 12 ns

Allows for fast signal transmission and efficient operation of the device.

Surface Mount: YES

Enables easy and convenient installation on circuit boards.

Nominal Supply Voltage / Vsup (V): 5

Works efficiently with standard 5V power supplies commonly used in electronics.

Output Characteristics: 3-STATE

Provides the ability to set the output to a high-impedance state, allowing for flexibility in signal routing.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity.

Minimum Operating Temperature: -40 °C

Can operate in extreme low-temperature environments without any issues.

Maximum Operating Temperature: 85 °C

Capable of functioning in high-temperature conditions without overheating.

Technical Specifications

Bus Driver & Transceivers SN74ACT573DWRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

BROADSIDE VERSION OF 373

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

ACT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

.04 mA

Propagation Delay At Nominal Supply:

12 ns

Propagation Delay (tpd):

12 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

SN74ACT573DWRG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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