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SN74AC533NSRE4

Texas Instruments

SN74AC533NSRE4 by Texas Instruments

SN74AC533NSRE4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 16 ns at 3.3V, suitable for industrial applications. It features a max I (ol) of 24A, operates b/w -40 to 85°C, and has a package style of small outline with gull wing terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,846 parts In-Stock

1+ parts

-

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4,846

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Vyrian

USA . 2,681 parts In-Stock

1+ parts

-

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-

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2,681

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 2,372 parts In-Stock

1+ parts

$2.298

100+ parts

-

1k+ parts

$2.207

10k+ parts

$2.207

2,372

$2.298

-

$2.207

$2.207

AZTECH Wire

Italy . 831 parts In-Stock

1+ parts

$15.064

100+ parts

-

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831

$15.064

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Parana Technologies

USA . 741 parts In-Stock

1+ parts

$18.253

100+ parts

-

1k+ parts

$18.385

10k+ parts

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741

$18.253

-

$18.385

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DigiPath Technology Company

USA . 1,316 parts In-Stock

1+ parts

$20.099

100+ parts

$18.491

1k+ parts

-

10k+ parts

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1,316

$20.099

$18.491

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IDEA Electronic Components Group

UK . 1,730 parts In-Stock

1+ parts

$20.509

100+ parts

$19.484

1k+ parts

$18.458

10k+ parts

-

1,730

$20.509

$19.484

$18.458

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ChromeModa Solutions

Germany . 1,089 parts In-Stock

1+ parts

$20.509

100+ parts

$16.817

1k+ parts

-

10k+ parts

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1,089

$20.509

$16.817

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One Stop Electronics

USA . 134 parts In-Stock

1+ parts

$33.000

100+ parts

-

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134

$33.000

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Microchip USA

USA . 4,092 parts In-Stock

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4,092

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Corphita

USA . 1,725 parts In-Stock

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1,725

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Overview

Enhance your electronic designs with the high-quality SN74AC533NSRE4 from Texas Instruments. This bus driver & transceiver offers reliable performance and versatility for a wide range of applications. With its advanced technology and industrial-grade construction, this product ensures optimal functionality in various environments. Experience the value of seamless data transmission, efficient power management, and compact design with the SN74AC533NSRE4. Trust Texas Instruments for innovative solutions that deliver exceptional results every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the product lightweight and durable, ideal for use in transportation applications.

Propagation Delay At Nominal Supply: 16 ns

The low propagation delay ensures fast and efficient data transmission, making this product suitable for high-speed communication applications.

Surface Mount: YES

The surface mount feature allows for easy installation and space-saving on PCBs, making it convenient for integration into electronic systems.

Nominal Supply Voltage / Vsup (V): 3.3

The compatibility with a 3.3V nominal supply voltage makes this product suitable for a wide range of electronic devices and systems that operate on this voltage level.

Output Characteristics: 3-STATE

The 3-STATE output characteristics allow for tristate logic implementation, enabling efficient control of signal flow and reducing power consumption when the bus driver is not actively driving the bus.

Technical Specifications

Bus Driver & Transceivers SN74AC533NSRE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Family:

AC

JESD-30 Code:

R-PDSO-G20

Length:

12.6 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3/5

Propagation Delay At Nominal Supply:

16 ns

Propagation Delay (tpd):

16.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5.3 mm

Trade Compliance

SN74AC533NSRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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