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SN74ABTH18504APMR

Texas Instruments

SN74ABTH18504APMR by Texas Instruments

SN74ABTH18504APMR by Texas Instruments is a 20-bit bus driver with 5.5 ns propagation delay at 5V, suitable for industrial applications. It features a 64-terminal flatpack package with low profile and fine pitch, operating b/w -40 to 85°C temperature range. With independent control and bidirectional count direction, it supports a max supply voltage of 5.5V and has a max power supply current of 27mA.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,904 parts In-Stock

1+ parts

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7,904

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Digiode

USA . 2,981 parts In-Stock

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2,981

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 182 parts In-Stock

1+ parts

$8.000

100+ parts

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182

$8.000

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AZTECH Wire

Italy . 542 parts In-Stock

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$11.324

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542

$11.324

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Parana Technologies

USA . 1,959 parts In-Stock

1+ parts

$26.666

100+ parts

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$27.222

10k+ parts

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1,959

$26.666

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$27.222

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ChromeModa Solutions

Germany . 2,546 parts In-Stock

1+ parts

$29.962

100+ parts

$24.569

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2,546

$29.962

$24.569

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IDEA Electronic Components Group

UK . 334 parts In-Stock

1+ parts

$29.962

100+ parts

$28.464

1k+ parts

$26.966

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334

$29.962

$28.464

$26.966

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QUARKTWIN TECHNOLOGY LTD

USA . 13,310 parts In-Stock

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13,310

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DigiPath Technology Company

USA . 1,149 parts In-Stock

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$27.014

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1,149

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$27.014

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Corphita

USA . 945 parts In-Stock

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945

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Microchip USA

USA . 409 parts In-Stock

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409

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Overview

Discover the SN74ABTH18504APMR by Texas Instruments, a high-quality Bus Driver & Transceiver that offers exceptional performance and reliability. With a sleek package body material and 3-STATE output characteristics, this product is perfect for a wide range of applications. Benefit from fast propagation delays, low power consumption, and independent control, making it an ideal choice for industrial-grade projects. Trust in Texas Instruments' reputation for innovation and excellence, and elevate your designs with the SN74ABTH18504APMR today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for use in various environments.

Propagation Delay At Nominal Supply: 5.5 ns

Low propagation delay ensures fast signal transmission, making the product efficient for high-speed communication.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on PCBs, saving space and reducing assembly time.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard voltage of 5V, making it compatible with most electronic systems and power sources.

Load Capacitance (CL): 50 pF

The low load capacitance ensures improved signal integrity and reduced signal distortion, leading to reliable data transmission.

Maximum I (ol): 64 Amp

High output current capacity allows the product to drive heavy loads without compromising performance, making it versatile for different applications.

Minimum Operating Temperature: -40 °C

Wide operating temperature range ensures reliable operation in extreme conditions, suitable for industrial environments.

Control Type: INDEPENDENT CONTROL

Independent control feature offers flexibility in managing communication protocols and data flow, enhancing the usability and adaptability of the product.

Technical Specifications

Bus Driver & Transceivers SN74ABTH18504APMR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION; WITH CLOCK ENABLE

Control Type:

INDEPENDENT CONTROL

Count Direction:

BIDIRECTIONAL

Family:

ABT

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

Load Capacitance (CL):

50 pF

Maximum I (ol):

64 Amp

No. of Bits:

20

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

27 mA

Propagation Delay At Nominal Supply:

5.5 ns

Propagation Delay (tpd):

5.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Width:

10 mm

Trade Compliance

SN74ABTH18504APMR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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