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SN74ABT843DBRG4

Texas Instruments

SN74ABT843DBRG4 by Texas Instruments

SN74ABT843DBRG4 by Texas Instruments is a 9-bit bus driver with 7.2 ns propagation delay at 5V, suitable for industrial applications. It features a small outline package, dual terminal position, and true output polarity, making it ideal for high-speed data transmission in electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,269 parts In-Stock

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Digiode

USA . 2,109 parts In-Stock

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2,109

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Distributors (Availability)

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One Stop Electronics

USA . 587 parts In-Stock

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$8.000

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587

$8.000

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Parana Technologies

USA . 2,051 parts In-Stock

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$15.067

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$15.480

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2,051

$15.067

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$15.480

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DigiPath Technology Company

USA . 100 parts In-Stock

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$16.590

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$15.263

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100

$16.590

$15.263

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ChromeModa Solutions

Germany . 6,801 parts In-Stock

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$16.929

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$13.882

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6,801

$16.929

$13.882

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IDEA Electronic Components Group

UK . 2,297 parts In-Stock

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$16.929

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$16.083

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$15.236

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2,297

$16.929

$16.083

$15.236

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AZTECH Wire

Italy . 646 parts In-Stock

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$17.026

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646

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Andel Nordic

Denmark . 4,026 parts In-Stock

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Microchip USA

USA . 2,652 parts In-Stock

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Corphita

USA . 1,729 parts In-Stock

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Overview

Unlock seamless data transmission and superior performance with the Texas Instruments SN74ABT843DBRG4 Bus Driver & Transceivers. Crafted with precision and expertise, Texas Instruments guarantees unmatched quality and reliability in every product. Ideal for a wide range of applications, this innovative device offers customers unrivaled value and benefits, ensuring smooth operation and efficiency. Experience the difference with Texas Instruments and take your projects to the next level with the SN74ABT843DBRG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability to the product, making it suitable for long-term use.

Propagation Delay At Nominal Supply: 7.2 ns

Low propagation delay ensures faster signal transmission, improving overall performance of the product.

Surface Mount: YES

Surface mount design allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

No. of Bits: 9

Having 9 bits provides sufficient data handling capacity for various applications, making the product versatile.

Nominal Supply Voltage / Vsup (V): 5

Operates at a commonly used supply voltage, ensuring compatibility with standard electronic systems.

Load Capacitance (CL): 50 pF

Low load capacitance helps in reducing power consumption and improving signal integrity.

Power Supplies (V): 5

Consistent power supply voltage provides stable operation of the product, enhancing reliability.

No. of Terminals: 24

Having 24 terminals allows for more connectivity options, increasing flexibility in system integration.

Maximum I (ol): 64 Amp

High maximum output current capability supports driving heavy loads, making the product suitable for power applications.

Propagation Delay (tpd): 7.2 ns

Low propagation delay ensures quick response times, critical for time-sensitive applications.

Maximum Operating Temperature: 85 °C

Wide operating temperature range allows the product to be used in various environmental conditions.

Output Characteristics: 3-STATE

3-state output allows for high impedance state, enabling multiple devices to share the same bus line.

Minimum Operating Temperature: -40 °C

Operating at low temperatures ensures the product can function reliably even in cold environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Nickel/Palladium/Gold terminal finish provides corrosion resistance and excellent conductivity, ensuring long-term performance.

Terminal Position: DUAL

Dual terminal position offers redundancy and increased reliability in case one terminal fails.

No. of Ports: 2

Having 2 ports allows for simultaneous data transfer between multiple devices, improving efficiency.

Maximum Seated Height: 2 mm

Low seated height makes the product suitable for compact designs and space-constrained applications.

Width: 5.3 mm

Narrow width allows for easy placement on a circuit board, optimizing space utilization.

Output Polarity: TRUE

True output polarity ensures correct signal transmission, reducing errors in data communication.

Minimum Supply Voltage (Vsup): 4.5 V

Supports low supply voltage operation, enabling the product to work efficiently even with limited power.

Peak Reflow Temperature °C: 260

High peak reflow temperature withstands harsh soldering processes, ensuring product durability during assembly.

Length: 8.2 mm

Compact length design allows for easy integration into space-constrained applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures the product can withstand rugged operating conditions, making it suitable for industrial applications.

Technology: BICMOS

BICMOS technology combines the benefits of both Bipolar and CMOS technologies, offering high speed and low power consumption.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical stability and ease of soldering during installation.

Packing Method: TR

TR packing method offers convenience in handling and storage, ensuring product protection during transportation.

Terminal Pitch: 0.65 mm

Fine terminal pitch allows for high-density mounting, optimizing PCB layout and enhancing overall system performance.

Maximum Supply Voltage (Vsup): 5.5 V

Supports a higher supply voltage range, providing flexibility in power supply options for different applications.

Maximum Power Supply Current (ICC): 34 mA

Low power supply current consumption helps in reducing energy usage and extending battery life in portable devices.

Technical Specifications

Bus Driver & Transceivers SN74ABT843DBRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH CLEAR AND PRESET; TYP VOLP < 1V @ VCC = 5V, TA = 25 DEG C

Family:

ABT

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

8.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

9

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP24,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

34 mA

Propagation Delay At Nominal Supply:

7.2 ns

Propagation Delay (tpd):

7.2 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Width:

5.3 mm

Trade Compliance

SN74ABT843DBRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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