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SN74ABT541BDWRG4

Texas Instruments

SN74ABT541BDWRG4 by Texas Instruments

SN74ABT541BDWRG4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 3.9 ns at 5V supply voltage. It features a small outline package, 3-STATE output characteristics, and operates in industrial temperature range. Ideal for applications requiring fast signal transmission and control over multiple ports.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 34,500 parts In-Stock

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34,500

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Vyrian

USA . 6,728 parts In-Stock

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6,728

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Digiode

USA . 4,120 parts In-Stock

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4,120

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Distributors (Availability)

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Andel Nordic

Denmark . 1,387 parts In-Stock

1+ parts

$6.874

100+ parts

-

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$6.599

10k+ parts

$6.599

1,387

$6.874

-

$6.599

$6.599

Parana Technologies

USA . 234 parts In-Stock

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$10.646

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-

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$11.137

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234

$10.646

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$11.137

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DigiPath Technology Company

USA . 408 parts In-Stock

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$11.723

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$10.785

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408

$11.723

$10.785

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ChromeModa Solutions

Germany . 3,190 parts In-Stock

1+ parts

$11.962

100+ parts

$9.809

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3,190

$11.962

$9.809

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IDEA Electronic Components Group

UK . 1,636 parts In-Stock

1+ parts

$11.962

100+ parts

$11.364

1k+ parts

$10.766

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1,636

$11.962

$11.364

$10.766

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AZTECH Wire

Italy . 696 parts In-Stock

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$19.252

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696

$19.252

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One Stop Electronics

USA . 464 parts In-Stock

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$23.000

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464

$23.000

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Microchip USA

USA . 2,838 parts In-Stock

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Corphita

USA . 2,835 parts In-Stock

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Overview

Enhance the efficiency and reliability of your electronic circuits with the SN74ABT541BDWRG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality bus drivers & transceivers that are essential for seamless data transmission in a wide range of applications. With a focus on performance and durability, this product provides exceptional value to customers by ensuring fast propagation delay, low power consumption, and versatile terminal options. Upgrade your systems today with Texas Instruments' cutting-edge technology for optimal results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it easy to handle and long-lasting.

Propagation Delay At Nominal Supply: 3.9 ns

The low propagation delay ensures fast signal transmission, making this product suitable for high-speed communication applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient integration into circuit boards, saving space and simplifying manufacturing processes.

No. of Bits: 8

Having 8 bits allows for a wide range of data transmission capabilities, making this product versatile in handling various data types.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes this product compatible with standard power sources, ensuring easy integration into existing systems.

Maximum Operating Temperature: 85°C

With a high maximum operating temperature, this product can withstand harsh environmental conditions, making it suitable for industrial applications.

Technology: BICMOS

Utilizing BiCMOS technology combines the benefits of both bipolar and CMOS technologies, offering high performance and low power consumption.

Technical Specifications

Bus Driver & Transceivers SN74ABT541BDWRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH DUAL OUTPUT ENABLE

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

ABT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

30 mA

Propagation Delay At Nominal Supply:

3.9 ns

Propagation Delay (tpd):

3.9 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

SN74ABT541BDWRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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