Loading...

SN74ABT245BDBRG4

Texas Instruments

SN74ABT245BDBRG4 by Texas Instruments

SN74ABT245BDBRG4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 3.9 ns at 5V, suitable for industrial applications. It features a small outline package with dual terminals and supports bidirectional communication with a max supply voltage of 5.5V and operating temperature range from -40 to 85°C.

Median Price

$0.422

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,227 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,227

-

-

-

-

Bristol Electronics

USA . 1,930 parts In-Stock

1+ parts

-

100+ parts

$0.422

1k+ parts

$0.315

10k+ parts

$0.292

1,930

-

$0.422

$0.315

$0.292

Microfarads

USA . 1,862 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,862

-

-

-

-

Digiode

USA . 625 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

625

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 687 parts In-Stock

1+ parts

$5.478

100+ parts

-

1k+ parts

$5.259

10k+ parts

$5.259

687

$5.478

-

$5.259

$5.259

Component Stockers USA

USA . 16,825 parts In-Stock

1+ parts

$5.540

100+ parts

-

1k+ parts

-

10k+ parts

-

16,825

$5.540

-

-

-

AZTECH Wire

Italy . 744 parts In-Stock

1+ parts

$10.036

100+ parts

-

1k+ parts

-

10k+ parts

-

744

$10.036

-

-

-

One Stop Electronics

USA . 464 parts In-Stock

1+ parts

$27.000

100+ parts

-

1k+ parts

-

10k+ parts

-

464

$27.000

-

-

-

Parana Technologies

USA . 1,072 parts In-Stock

1+ parts

$28.738

100+ parts

-

1k+ parts

$51.201

10k+ parts

-

1,072

$28.738

-

$51.201

-

DigiPath Technology Company

USA . 1,296 parts In-Stock

1+ parts

$31.644

100+ parts

$29.113

1k+ parts

-

10k+ parts

-

1,296

$31.644

$29.113

-

-

ChromeModa Solutions

Germany . 3,356 parts In-Stock

1+ parts

$32.290

100+ parts

$26.478

1k+ parts

-

10k+ parts

-

3,356

$32.290

$26.478

-

-

IDEA Electronic Components Group

UK . 334 parts In-Stock

1+ parts

$32.290

100+ parts

$30.676

1k+ parts

$29.061

10k+ parts

-

334

$32.290

$30.676

$29.061

-

QUARKTWIN TECHNOLOGY LTD

USA . 12,860 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

12,860

-

-

-

-

Microchip USA

USA . 4,397 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,397

-

-

-

-

Perfect Parts

USA . 2,262 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,262

-

-

-

-

Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

-

-

-

-

Corphita

USA . 1,526 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,526

-

-

-

-

GreenTree Electronics

Israel . 50 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

50

-

-

-

-

Overview

Enhance the performance of your electronic designs with the SN74ABT245BDBRG4 from Texas Instruments, a trusted leader in semiconductor manufacturing. This high-quality Bus Driver & Transceiver is designed to deliver fast signal propagation and reliable data transmission in various applications. With its 3-STATE output characteristics and TRUE output polarity, this compact and efficient device offers customers unmatched value and flexibility. Upgrade your projects with the SN74ABT245BDBRG4 and experience the advantages of Texas Instruments' cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the bus driver & transceivers, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 3.9 ns

Low propagation delay ensures fast signal transmission, making this product suitable for high-speed bus communication.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, saving space and simplifying the assembly process.

No. of Bits: 8

8-bit resolution provides sufficient data transfer capabilities for various bus communication applications.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard 5V supply voltage, making it compatible with many existing systems and easy to power.

Load Capacitance (CL): 50 pF

Suitable load capacitance ensures stable signal transmission and reception without distortion or signal loss.

Power Supplies (V): 5

Consistent power supply voltage of 5V ensures reliable operation and performance of the bus driver & transceivers.

No. of Terminals: 20

Sufficient terminals provide ample connections for interfacing with other components and systems in the bus network.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

Compact small outline package with shrink pitch design saves space on the PCB and facilitates dense layout configurations.

Maximum I (ol): 64 Amp

High output current capability of 64Amp allows for driving and controlling heavy loads in the bus system efficiently.

Propagation Delay (tpd): 3.9 ns

Low propagation delay ensures minimal delay in signal transmission, improving the overall efficiency of the bus communication.

Maximum Operating Temperature: 85 °C

Wide operating temperature range of up to 85°C enables reliable operation in various environmental conditions.

Output Characteristics: 3-STATE

3-state output allows for controlling the bus driver & transceivers in multiple output states, enhancing flexibility in bus communication.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40°C ensures reliable performance even in cold environments where temperature may drop significantly.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Nickel/Palladium/Gold terminal finish provides corrosion resistance and ensures reliable electrical connections for long-term operation.

Terminal Position: DUAL

Dual terminal position offers flexibility in mounting and connection options, accommodating various PCB layouts and configurations.

No. of Ports: 2

2 ports provide multiple connection options for interfacing with different devices and peripherals in the bus network.

Maximum Seated Height: 2 mm

Low seated height of 2mm enables compact and slim design integration, ideal for space-constrained applications.

Width: 5.3 mm

Slim width dimension of 5.3mm allows for dense packing on the PCB, optimizing space usage and layout efficiency.

Output Polarity: TRUE

True output polarity ensures accurate signal transmission and reception, minimizing errors and improving overall system reliability.

Minimum Supply Voltage (Vsup): 4.5 V

Low minimum supply voltage of 4.5V allows for operation in low-power scenarios and extends the operational range of the product.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260°C ensures reliable soldering and assembly during manufacturing processes.

Length: 7.2 mm

Compact length dimension of 7.2mm facilitates flexible placement and integration on the PCB, optimizing space utilization.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in harsh industrial environments with varying temperature conditions.

Technology: BICMOS

BICMOS technology combines the advantages of both bipolar and CMOS technologies, offering high performance and low power consumption for efficient bus communication.

Terminal Form: GULL WING

Gull wing terminal form provides secure and reliable solder connections, enhancing the overall durability and long-term performance of the product.

Packing Method: TR

TR (Tape and Reel) packing method offers convenient handling and storage during manufacturing and assembly processes, ensuring efficient production workflows.

Terminal Pitch: 0.65 mm

Fine terminal pitch of 0.65mm allows for precise and compact connections, enabling high-density integration on the PCB.

Count Direction: BIDIRECTIONAL

Bidirectional count direction provides versatility in signal transmission and reception, supporting two-way communication in the bus system.

Control Type: COMMON CONTROL

Common control type simplifies the management and operation of the bus driver & transceivers, allowing for centralized control and monitoring.

Maximum Supply Voltage (Vsup): 5.5 V

Maximum supply voltage of 5.5V ensures safe operation within the specified voltage range, preventing damage to the product.

Maximum Power Supply Current (ICC): 30 mA

Low power supply current of 30mA minimizes power consumption and heat dissipation, contributing to energy efficiency and long-term reliability.

Technical Specifications

Bus Driver & Transceivers SN74ABT245BDBRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH DIRECTION CONTROL

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

ABT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

7.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

30 mA

Propagation Delay At Nominal Supply:

3.9 ns

Propagation Delay (tpd):

3.9 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Width:

5.3 mm

Trade Compliance

SN74ABT245BDBRG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20