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SN74ABT16373ADLRG4

Texas Instruments

SN74ABT16373ADLRG4 by Texas Instruments

SN74ABT16373ADLRG4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 6.3 ns at 5V, featuring a small outline package and dual terminal position. It operates in industrial temperature range (-40 to 85°C) and supports true output polarity, making it ideal for high-speed data transmission applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,289 parts In-Stock

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Nova Conductors

Japan . 800 parts In-Stock

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800

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EMSNET

USA . 760 parts In-Stock

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760

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Digiode

USA . 97 parts In-Stock

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Andel Nordic

Denmark . 1,322 parts In-Stock

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$3.075

100+ parts

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$2.952

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$2.952

1,322

$3.075

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$2.952

Parana Technologies

USA . 1,522 parts In-Stock

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$14.679

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$15.120

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1,522

$14.679

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AZTECH Wire

Italy . 884 parts In-Stock

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$15.705

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DigiPath Technology Company

USA . 1,028 parts In-Stock

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$16.163

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$14.870

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$16.163

$14.870

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ChromeModa Solutions

Germany . 3,318 parts In-Stock

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$16.493

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$13.524

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$13.524

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IDEA Electronic Components Group

UK . 1,332 parts In-Stock

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$16.493

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$15.668

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$14.844

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1,332

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$15.668

$14.844

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Ampacity Inc.

Singapore . 1,285 parts In-Stock

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$31.000

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One Stop Electronics

USA . 1,136 parts In-Stock

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$42.000

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Corphita

USA . 2,921 parts In-Stock

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Microchip USA

USA . 1,300 parts In-Stock

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Bastille Electronics

Australia . 200 parts In-Stock

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Kepictronics

USA . 196 parts In-Stock

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Overview

Experience unparalleled performance and reliability with the SN74ABT16373ADLRG4 by Texas Instruments, a leading manufacturer in the industry. This Bus Driver & Transceiver is a versatile solution for a wide range of applications, offering 8 bits of data transfer with 3-STATE output characteristics. With a compact design and dual terminal position, this product provides efficient and seamless operation while maintaining high-quality standards. Trust Texas Instruments to deliver exceptional value and benefits, making your projects more efficient and reliable than ever before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability for the product, making it suitable for a variety of environments.

Propagation Delay At Nominal Supply: 6.3 ns

Low propagation delay ensures fast and efficient signal transmission, making the product ideal for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

No. of Functions: 2

Having multiple functions in a single device reduces the need for additional components, simplifying the design and reducing overall costs.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard supply voltage of 5V makes the product compatible with a wide range of systems, offering versatility in application.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions and ensure reliable performance in industrial settings.

Technical Specifications

Bus Driver & Transceivers SN74ABT16373ADLRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

TYP VOLP < 0.8V @ VCC = 5V, TA = 25 DEG C

Control Type:

ENABLE LOW/HIGH

Count Direction:

UNIDIRECTIONAL

Family:

ABT

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

15.875 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP48,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

85 mA

Propagation Delay At Nominal Supply:

6.3 ns

Propagation Delay (tpd):

6.1 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.79 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

7.5 mm

Trade Compliance

SN74ABT16373ADLRG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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