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SN74ABT162601DGG

Texas Instruments

SN74ABT162601DGG by Texas Instruments

SN74ABT162601DGG by Texas Instruments is an 18-bit bus driver with a propagation delay of 5.7 ns at 5V, featuring a small outline package for industrial applications. It offers a max I (ol) of 64A, operates b/w -40 to 85°C, and supports bidirectional data flow with independent control.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,378 parts In-Stock

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Digiode

USA . 3,926 parts In-Stock

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3,926

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Distributors (Availability)

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Andel Nordic

Denmark . 3,919 parts In-Stock

1+ parts

$7.828

100+ parts

-

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$7.515

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$7.515

3,919

$7.828

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$7.515

Parana Technologies

USA . 2,290 parts In-Stock

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$10.684

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$11.174

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2,290

$10.684

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$11.174

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DigiPath Technology Company

USA . 2,184 parts In-Stock

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$11.765

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$11.765

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IDEA Electronic Components Group

UK . 2,149 parts In-Stock

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$12.005

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$11.405

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$10.804

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2,149

$12.005

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$10.804

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ChromeModa Solutions

Germany . 1,367 parts In-Stock

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$12.005

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$9.844

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1,367

$12.005

$9.844

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AZTECH Wire

Italy . 654 parts In-Stock

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$19.586

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654

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One Stop Electronics

USA . 1,013 parts In-Stock

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$62.000

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$62.000

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Component Stockers USA

USA . 726 parts In-Stock

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$99.990

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726

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 7,844 parts In-Stock

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Corphita

USA . 1,714 parts In-Stock

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Microchip USA

USA . 196 parts In-Stock

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Overview

Upgrade your electronic designs with the SN74ABT162601DGG from Texas Instruments, a top-tier manufacturer known for quality and reliability. This bus driver & transceiver offers lightning-fast propagation delays, versatile surface mount options, and 3-state output characteristics. With a nominal supply voltage of 5V and independent control features, this product is perfect for a wide range of industrial applications. Don't settle for second best - choose Texas Instruments for superior performance and peace of mind.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it easy to handle and long-lasting.

Propagation Delay At Nominal Supply: 5.7 ns

With a low propagation delay, the product ensures efficient and fast communication between devices, making it suitable for applications requiring quick responses.

Surface Mount: YES

Being surface mountable allows for easy and compact integration onto circuit boards, saving space and simplifying the assembly process.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures the product can function reliably even in harsh industrial environments, providing consistent performance.

Output Characteristics: 3-STATE

3-STATE output allows for multiple devices to share a common bus line without interference, enhancing flexibility and efficiency in data transmission.

Technical Specifications

Bus Driver & Transceivers SN74ABT162601DGG attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

INDEPENDENT CONTROL

Count Direction:

BIDIRECTIONAL

JESD-30 Code:

R-PDSO-G56

Maximum I (ol):

64 Amp

No. of Bits:

18

No. of Functions:

1

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP56,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

36 mA

Propagation Delay At Nominal Supply:

5.7 ns

Qualification:

Not Qualified

Sub-Category:

Bus Driver/Transceivers

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Trade Compliance

SN74ABT162601DGG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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