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SN74ABT125DRG4

Texas Instruments

SN74ABT125DRG4 by Texas Instruments

SN74ABT125DRG4 by Texas Instruments is a 4-function bus driver with 4.9 ns propagation delay at 5V, suitable for industrial applications. It features a small outline package style, true output polarity, and enables low control type. With a max supply voltage of 5.5V and operating temperature range from -40 to 85°C, it offers reliable performance in various electronic systems.

Median Price

$0.418

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 700 parts In-Stock

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$0.418

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Vyrian

USA . 7,306 parts In-Stock

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Sea View Technologies

USA . 4,856 parts In-Stock

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Bristol Electronics

USA . 4,261 parts In-Stock

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Digiode

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Chip Stock

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Connector Distribution Corp

USA . 1,694 parts In-Stock

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Right Parts Inc.

USA . 1,694 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 112 parts In-Stock

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$0.418

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Continental Prestige Electronics

USA . 4,646 parts In-Stock

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$0.418

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$0.410

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Argo Parts USA

USA . 3,493 parts In-Stock

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$0.418

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$0.405

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Netroflash

USA . 2,000 parts In-Stock

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$0.418

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AZTECH Wire

Italy . 493 parts In-Stock

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$9.217

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Parana Technologies

USA . 2,226 parts In-Stock

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$12.692

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$13.157

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DigiPath Technology Company

USA . 2,058 parts In-Stock

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$13.976

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ChromeModa Solutions

Germany . 6,487 parts In-Stock

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$14.261

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IDEA Electronic Components Group

UK . 572 parts In-Stock

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$14.261

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$13.548

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$12.835

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Ampacity Inc.

Singapore . 701 parts In-Stock

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$30.000

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One Stop Electronics

USA . 1,155 parts In-Stock

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Semicontronic

India . 1,357 parts In-Stock

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$63.000

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$61.425

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Microchip USA

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Corphita

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Kepictronics

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Overview

Upgrade your electronic designs with the SN74ABT125DRG4 by Texas Instruments, a high-quality Bus Driver & Transceiver that offers exceptional performance and reliability. With 3-STATE output characteristics and a propagation delay of just 4.9 ns, this small outline package is ideal for industrial applications where speed and precision are crucial. Benefit from Texas Instruments' renowned expertise in semiconductor technology and trust in the value this product brings to your projects. Choose the SN74ABT125DRG4 for seamless data transmission and superior results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the product lightweight and durable, providing long-lasting performance.

Propagation Delay At Nominal Supply: 4.9 ns

The low propagation delay ensures fast and efficient signal transmission within the bus driver, leading to improved system response time.

Surface Mount: YES

Being surface mountable, this product is easy to install and saves space on the PCB, making it suitable for compact electronic designs.

No. of Functions: 4

With multiple functions, this bus driver & transceiver can handle various tasks simultaneously, enhancing its versatility and usability in different applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V, this product is compatible with standard power sources, ensuring easy integration into existing systems.

Load Capacitance (CL): 50 pF

The specified load capacitance helps in determining the maximum capacitive load the product can drive, ensuring efficient signal transmission in the circuit.

Power Supplies (V): 5

The product operates at a standard power supply voltage of 5V, making it suitable for a wide range of electronic systems and applications.

No. of Terminals: 14

Having 14 terminals allows for easy connectivity and integration with other components in the circuit, facilitating streamlined circuit design and implementation.

Maximum I (ol): 64 Amp

The high output current capability of 64 Amp enables the product to drive heavy loads with ease, making it suitable for demanding applications that require robust performance.

Output Characteristics: 3-STATE

The 3-STATE output characteristics provide flexibility in controlling the output signal, allowing for tri-state logic implementation and enhancing the product's functionality.

Minimum Operating Temperature: -40 °C

The wide operating temperature range of -40°C ensures reliable performance in harsh environmental conditions, making it suitable for industrial applications where temperature fluctuation is common.

Maximum Operating Temperature: 85 °C

Operating within a temperature range of up to 85°C ensures stable performance even in high-temperature environments, enhancing the product's reliability and longevity.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of nickel/palladium/gold terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable electrical connections for long-term performance.

Terminal Position: DUAL

The dual terminal position allows for flexible installation and connectivity options, making it easier to integrate the product into different circuit configurations.

No. of Ports: 2

Having 2 ports enables the product to handle multiple input/output connections, enhancing its connectivity and functionality in complex electronic systems.

Output Polarity: TRUE

The true output polarity ensures accurate signal transmission and processing, eliminating any confusion or errors in data communication within the circuit.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade environments, this product meets the reliability and performance standards required for industrial applications, making it a suitable choice for rugged operating conditions.

Technology: BICMOS

Utilizing BICMOS technology combines the advantages of both bipolar and CMOS technologies, offering high-speed operation, low power consumption, and enhanced noise immunity for improved overall performance.

Terminal Form: GULL WING

The gull wing terminal form ensures easy soldering and secure mechanical connection, simplifying the assembly process and ensuring robust electrical connections in the circuit.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, the product can withstand high-temperature soldering processes during assembly, ensuring reliable and durable solder joints.

Technical Specifications

Bus Driver & Transceivers SN74ABT125DRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

TYP VOLP < 1V @ VCC = 5V, TA = 25 DEG C

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

ABT

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

30 mA

Propagation Delay At Nominal Supply:

4.9 ns

Propagation Delay (tpd):

4.9 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

SN74ABT125DRG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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