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SN74ABT125DRE4

Texas Instruments

SN74ABT125DRE4 by Texas Instruments

SN74ABT125DRE4 by Texas Instruments is a 4-function bus driver with 3-STATE output characteristics. It has a propagation delay of 4.9 ns at 5V, suitable for industrial applications requiring fast signal transmission. This small outline package with dual terminals and gull wing form is ideal for surface mount designs in tight spaces.

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1k+

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Vyrian

USA . 3,876 parts In-Stock

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Digiode

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Nova Conductors

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AZTECH Wire

Italy . 335 parts In-Stock

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$5.426

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Corohmni

South Africa . 57 parts In-Stock

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$8.860

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Andel Nordic

Denmark . 2,140 parts In-Stock

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$9.011

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$8.651

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Ampacity Inc.

Singapore . 1,057 parts In-Stock

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$13.000

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Parana Technologies

USA . 896 parts In-Stock

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$15.544

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$1,443.482

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$13.989

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DigiPath Technology Company

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ChromeModa Solutions

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$17.465

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$14.321

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IDEA Electronic Components Group

UK . 441 parts In-Stock

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One Stop Electronics

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Overview

Elevate your electronic designs with the SN74ABT125DRE4 by Texas Instruments, a top-tier bus driver and transceiver that delivers unmatched quality and reliability. Manufactured by Texas Instruments, a trusted name in the industry, this versatile component offers exceptional performance in a wide range of applications. With a nominal supply voltage of 5V and a propagation delay of just 4.9 ns, this product ensures fast and efficient data transmission. Experience the value and benefits of this compact and efficient solution for all your circuitry needs. Upgrade to the SN74ABT125DRE4 and take your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material offers durability and heat resistance, making it suitable for various operating conditions.

Propagation Delay At Nominal Supply: 4.9 ns

Low propagation delay ensures fast signal transmission, resulting in efficient communication within the bus system.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and reducing assembly complexity.

No. of Functions: 4

Having 4 functions in a single component simplifies the circuit design and reduces the overall component count, leading to cost savings and increased efficiency.

Nominal Supply Voltage / Vsup (V): 5

Operating at a common supply voltage of 5V ensures compatibility with standard bus driver and transceiver configurations.

Load Capacitance (CL): 50 pF

The low load capacitance helps in maintaining signal integrity and reducing signal distortion, ensuring reliable data transmission.

Power Supplies (V): 5

Running on a 5V power supply simplifies the power management system and enhances compatibility with other components in the bus system.

No. of Terminals: 14

Having 14 terminals allows for connection to multiple input and output ports, enabling versatile communication capabilities in the bus system.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board and facilitates denser PCB layouts for compact bus driver and transceiver designs.

Maximum I (ol): 64 Amp

The high maximum output current capability of 64A ensures compatibility with a wide range of bus loads, supporting robust and reliable data transmission.

Propagation Delay (tpd): 4.9 ns

The low propagation delay of 4.9 ns ensures swift signal propagation, reducing latency and improving overall bus system performance.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable operation in industrial environments with elevated temperatures.

Output Characteristics: 3-STATE

The 3-state output characteristics allow for multi-drop bus configurations and efficient control of bus signals, enhancing flexibility in communication protocols.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures operational reliability even in harsh environmental conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The terminal finish of Ni/Pd/Au provides excellent conductivity, corrosion resistance, and solderability for reliable electrical connections.

Terminal Position: DUAL

The dual terminal position allows for flexible mounting orientations and enables easy integration into various bus system configurations.

No. of Ports: 2

Having 2 ports provides bi-directional communication capabilities, enabling data exchange between different bus segments for enhanced connectivity.

Maximum Seated Height: 1.75 mm

The low maximum seated height facilitates compact and slimline designs, ideal for space-constrained bus driver and transceiver applications.

Width: 3.9 mm

The narrow width of 3.9 mm allows for space-efficient placement on the PCB, supporting compact and streamlined bus system layouts.

Output Polarity: TRUE

The true output polarity ensures accurate signal representation, preventing signal misinterpretation and enhancing data integrity in the bus system.

Minimum Supply Voltage (Vsup): 4.5 V

The low minimum supply voltage requirement of 4.5V enables operation with minimal power consumption, enhancing energy efficiency in bus system operation.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C facilitates robust soldering processes, ensuring reliable and durable connections during assembly.

Length: 8.65 mm

The compact length of 8.65 mm contributes to a small form factor design, enabling space-efficient integration in bus driver and transceiver setups.

Temperature Grade: INDUSTRIAL

The industrial temperature grade rating indicates reliability and performance in demanding industrial environments, ensuring consistent operation under harsh conditions.

Technology: BICMOS

Utilizing Bipolar-CMOS technology offers a balance between speed, power consumption, and noise immunity, making it suitable for high-performance bus driver and transceiver applications.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical strength and facilitates surface mount assembly, ensuring secure and reliable PCB connections.

Packing Method: TR

The Tape and Reel (TR) packing method simplifies component handling, storage, and automated assembly processes, enhancing manufacturing efficiency.

Terminal Pitch: 1.27 mm

The standard terminal pitch of 1.27 mm offers compatibility with common soldering techniques and PCB layouts, ensuring easy integration into bus system designs.

Count Direction: UNIDIRECTIONAL

The unidirectional count direction simplifies signal routing and management in one direction, streamlining communication flow within the bus system.

Control Type: ENABLE LOW

The enable low control type allows for efficient signal activation and deactivation, offering precise control over bus driver and transceiver operation.

Maximum Supply Voltage (Vsup): 5.5 V

Operating within a maximum supply voltage of 5.5V ensures component reliability and compatibility in various bus system configurations.

Maximum Power Supply Current (ICC): 30 mA

The low maximum power supply current of 30 mA indicates efficient power management and minimal energy consumption, contributing to overall system efficiency.

Technical Specifications

Bus Driver & Transceivers SN74ABT125DRE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

TYP VOLP < 1V @ VCC = 5V, TA = 25 DEG C

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

ABT

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

30 mA

Propagation Delay At Nominal Supply:

4.9 ns

Propagation Delay (tpd):

4.9 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

SN74ABT125DRE4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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