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SN55LBC173TDA2

Texas Instruments

SN55LBC173TDA2 by Texas Instruments

SN55LBC173TDA2 by Texas Instruments is a 16-terminal BICMOS line receiver with 4 functions. It supports EIA-422-A, EIA-423-A, EIA-485, and CCITT V.11 interface standards. With a max supply current of 11 mA and differential input characteristics, it's ideal for applications requiring true output polarity in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,069 parts In-Stock

1+ parts

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5,069

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Digiode

USA . 1,573 parts In-Stock

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1,573

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 905 parts In-Stock

1+ parts

$0.500

100+ parts

-

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905

$0.500

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Parana Technologies

USA . 1,383 parts In-Stock

1+ parts

$12.779

100+ parts

-

1k+ parts

$13.246

10k+ parts

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1,383

$12.779

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$13.246

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AZTECH Wire

Italy . 789 parts In-Stock

1+ parts

$13.312

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789

$13.312

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DigiPath Technology Company

USA . 1,225 parts In-Stock

1+ parts

$14.071

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1,225

$14.071

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ChromeModa Solutions

Germany . 505 parts In-Stock

1+ parts

$14.358

100+ parts

$11.774

1k+ parts

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505

$14.358

$11.774

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IDEA Electronic Components Group

UK . 254 parts In-Stock

1+ parts

$14.358

100+ parts

$13.640

1k+ parts

$12.922

10k+ parts

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254

$14.358

$13.640

$12.922

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Component Stockers USA

USA . 358 parts In-Stock

1+ parts

$99.990

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358

$99.990

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Microchip USA

USA . 1,035 parts In-Stock

1+ parts

$329.480

100+ parts

$320.700

1k+ parts

$316.310

10k+ parts

$311.910

1,035

$329.480

$320.700

$316.310

$311.910

Corphita

USA . 4,643 parts In-Stock

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Overview

Unlock the power of reliable communication with the SN55LBC173TDA2 by Texas Instruments. As a trusted manufacturer in the industry, Texas Instruments delivers top-quality line drivers and receivers that provide seamless connectivity for a variety of applications. With advanced technology and precision engineering, this product offers unmatched performance, efficiency, and durability. Whether you're in need of robust data transmission or signal conditioning, the SN55LBC173TDA2 is the perfect solution to streamline your operations and enhance your connectivity. Experience the value and benefits of this exceptional product today.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient installation, making this product suitable for compact and dense electronic designs.

No. of Functions: 4

Having multiple functions in one package helps to simplify circuit designs and save space on the PCB.

Package Style: RECTANGULAR

Rectangular packages are commonly used and provide stability and ease of handling during assembly.

Output Characteristics: 3-STATE

The 3-state output allows for high flexibility in interfacing with other components, enabling efficient control of signals.

Technology: BICMOS

BICMOS technology offers a combination of bipolar and CMOS features, providing high speed and low power consumption for improved performance.

Nominal Supply Voltage: 5 V

Operating at a common and standard supply voltage of 5V ensures compatibility with a wide range of systems and reduces the need for additional voltage regulation.

Interface Standard: EIA-422-A; EIA-423-A; EIA-485; CCITT V.11

Compliance with multiple interface standards allows for seamless integration into various communication systems and protocols, enhancing versatility and interoperability.

Technical Specifications

Line Drivers & Receivers SN55LBC173TDA2 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

NO

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

EIA-422-A; EIA-423-A; EIA-485; CCITT V.11

JESD-30 Code:

R-XUUC-N16

Length:

2.04 mm

No. of Functions:

4

No. of Terminals:

16

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Peak Reflow Temperature (C):

NOT SPECIFIED

Receiver No. of Bits:

4

Maximum Supply Current:

11 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BICMOS

Terminal Form:

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.932 mm

Trade Compliance

SN55LBC173TDA2 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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