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SN55454BJG-00

Texas Instruments

SN55454BJG-00 by Texas Instruments

SN55454BJG-00 by Texas Instruments is a NOR gate-based peripheral driver with 2 functions, operating at 4.5-5.5V. It offers transient protection, MILITARY-grade temperature range (-55 to 125 °C), and 0.5A output peak current limit. Ideal for applications requiring fast turn-on/off times (0.035 us) in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,194 parts In-Stock

1+ parts

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8,194

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Digiode

USA . 1,927 parts In-Stock

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1,927

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,054 parts In-Stock

1+ parts

$8.500

100+ parts

-

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1,054

$8.500

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AZTECH Wire

Italy . 581 parts In-Stock

1+ parts

$9.293

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581

$9.293

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Parana Technologies

USA . 1,153 parts In-Stock

1+ parts

$12.958

100+ parts

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$13.450

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1,153

$12.958

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$13.450

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DigiPath Technology Company

USA . 1,076 parts In-Stock

1+ parts

$14.269

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1,076

$14.269

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ChromeModa Solutions

Germany . 5,010 parts In-Stock

1+ parts

$14.560

100+ parts

$11.939

1k+ parts

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5,010

$14.560

$11.939

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IDEA Electronic Components Group

UK . 749 parts In-Stock

1+ parts

$14.560

100+ parts

$13.832

1k+ parts

$13.104

10k+ parts

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749

$14.560

$13.832

$13.104

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Corphita

USA . 1,998 parts In-Stock

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1,998

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Overview

Unlock the potential of your electronic projects with the SN55454BJG-00 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality peripheral drivers that guarantee reliability and performance. Whether you're designing industrial control systems or consumer electronics, this versatile component offers built-in protections and efficient functionality to enhance your applications. Trust Texas Instruments to provide innovative solutions that meet your needs and exceed your expectations. Elevate your projects with the SN55454BJG-00 and experience the value and advantages it brings to your designs.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic and glass-sealed package body material ensures durability and thermal stability, making this peripheral driver suitable for harsh environments.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage of 5.5V provides flexibility in power supply options and allows for compatibility with a wide range of systems.

No. of Functions: 2

With 2 functions in one device, this peripheral driver offers cost efficiency and space-saving benefits by combining multiple functions in a single component.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration and mounting on circuit boards, optimizing space utilization in a system.

Built-in Protections: TRANSIENT

The built-in transient protection feature safeguards the peripheral driver and connected devices from voltage spikes or transients, enhancing overall system reliability.

No. of Terminals: 8

Having 8 terminals provides sufficient connectivity options for interfacing with other components, enabling versatile application possibilities.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures reliable performance even in elevated temperature environments, making this peripheral driver ideal for demanding industrial applications.

Minimum Operating Temperature: -55 °C

With a minimum operating temperature of -55°C, this peripheral driver is suitable for use in extreme cold conditions without sacrificing functionality.

Terminal Form: THROUGH-HOLE

The through-hole terminal form facilitates easy soldering and secure connection to the circuit board, simplifying the assembly process and ensuring robust electrical connections.

Nominal Output Peak Current Limit: 0.5 A

The nominal output peak current limit of 0.5A ensures safe operation by preventing excessive current flow, protecting both the peripheral driver and connected devices.

Technical Specifications

Peripheral Drivers SN55454BJG-00 attributes and parameters. Explore more Peripheral Drivers devices from Texas Instruments

Specs

Built-in Protections:

TRANSIENT

JESD-30 Code:

R-GDIP-T8

Length:

9.6 mm

No. of Functions:

2

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

.5 A

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Turn-off Time:

.035 us

Turn-on Time:

.035 us

Width:

7.62 mm

Trade Compliance

SN55454BJG-00 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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