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SN55454JG

Texas Instruments

SN55454JG by Texas Instruments

SN55454JG by Texas Instruments is a BIPOLAR technology Peripheral Driver with 8 terminals and a 5V supply voltage. It operates in temperatures ranging from -55°C to 125°C, making it suitable for MILITARY-grade applications. The driver features a RECTANGULAR CERAMIC package style and is ideal for various IN-LINE configurations.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,194 parts In-Stock

1+ parts

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8,194

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Digiode

USA . 2,711 parts In-Stock

1+ parts

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2,711

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Electronic Expediters

USA . 3 parts In-Stock

1+ parts

-

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3

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 341 parts In-Stock

1+ parts

$7.852

100+ parts

$729.221

1k+ parts

$7.067

10k+ parts

-

341

$7.852

$729.221

$7.067

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DigiPath Technology Company

USA . 1,627 parts In-Stock

1+ parts

$8.647

100+ parts

-

1k+ parts

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10k+ parts

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1,627

$8.647

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ChromeModa Solutions

Germany . 3,286 parts In-Stock

1+ parts

$8.823

100+ parts

$7.235

1k+ parts

-

10k+ parts

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3,286

$8.823

$7.235

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IDEA Electronic Components Group

UK . 1,715 parts In-Stock

1+ parts

$8.823

100+ parts

$8.382

1k+ parts

$7.941

10k+ parts

-

1,715

$8.823

$8.382

$7.941

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AZTECH Wire

Italy . 333 parts In-Stock

1+ parts

$18.356

100+ parts

-

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333

$18.356

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One Stop Electronics

USA . 732 parts In-Stock

1+ parts

$38.500

100+ parts

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732

$38.500

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Corphita

USA . 3,912 parts In-Stock

1+ parts

-

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3,912

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Overview

Upgrade your electronics with the SN55454JG by Texas Instruments, a high-quality peripheral driver perfect for military-grade applications. With a package made of durable ceramic material and a temperature range from -55°C to 125°C, this driver offers reliability and performance in extreme conditions. Designed with 2 driver bits and 8 terminals, this product ensures seamless integration and efficient power supply at 5V. Trust Texas Instruments for cutting-edge technology and superior products that deliver value and innovation to every project.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages provide excellent thermal conductivity and high resistance to temperature changes, ensuring reliable performance in various operating conditions.

Power Supplies (V): 5

Operating at 5V allows for compatibility with common power sources and ensures stable performance.

No. of Terminals: 8

Having 8 terminals allows for flexibility in connecting and controlling multiple functions or components.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures reliable performance even in demanding environments.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55°C enables this product to function effectively in extreme cold conditions.

Technology: BIPOLAR

Bipolar technology offers high-speed switching and precise control, making this driver suitable for applications requiring accuracy and efficiency.

Technical Specifications

Peripheral Drivers SN55454JG attributes and parameters. Explore more Peripheral Drivers devices from Texas Instruments

Specs

Driver No. of Bits:

2

JESD-30 Code:

R-XDIP-T8

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Peripheral Drivers

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN55454JG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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