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SN55452BFK

Texas Instruments

SN55452BFK by Texas Instruments

SN55452BFK by Texas Instruments is a peripheral driver with 2 functions, operating at 5V. It features open-collector output characteristics and a max output current of 0.4A. Ideal for military-grade applications requiring NAND gate-based peripheral drivers in a chip carrier package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,874 parts In-Stock

1+ parts

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100+ parts

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3,874

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Digiode

USA . 1,705 parts In-Stock

1+ parts

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1,705

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 504 parts In-Stock

1+ parts

$2.787

100+ parts

-

1k+ parts

$3.272

10k+ parts

-

504

$2.787

-

$3.272

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DigiPath Technology Company

USA . 1,517 parts In-Stock

1+ parts

$3.068

100+ parts

$2.823

1k+ parts

-

10k+ parts

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1,517

$3.068

$2.823

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IDEA Electronic Components Group

UK . 874 parts In-Stock

1+ parts

$3.131

100+ parts

-

1k+ parts

$2.818

10k+ parts

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874

$3.131

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$2.818

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ChromeModa Solutions

Germany . 300 parts In-Stock

1+ parts

$3.131

100+ parts

$2.567

1k+ parts

-

10k+ parts

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300

$3.131

$2.567

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One Stop Electronics

USA . 1,023 parts In-Stock

1+ parts

$12.500

100+ parts

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1,023

$12.500

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AZTECH Wire

Italy . 424 parts In-Stock

1+ parts

$18.184

100+ parts

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424

$18.184

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Corphita

USA . 3,107 parts In-Stock

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3,107

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Overview

Enhance your electronic projects with the high-quality SN55452BFK by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers superior products that guarantee reliability and performance. The SN55452BFK falls under the category of Peripheral Drivers, making it essential for driving various components in your circuits. With its advanced technology and military-grade temperature grade, this chip carrier package offers unparalleled value and benefits to customers. Upgrade your designs with the SN55452BFK and experience seamless operation and efficiency like never before.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

Provides excellent durability and reliability for the product, ensuring it can withstand tough operating conditions.

Surface Mount: YES

Allows for easy and efficient integration onto circuit boards, saving space and simplifying the assembly process.

Maximum Supply Voltage: 5.5 V

Supports a wide range of supply voltages, making it versatile and compatible with various systems.

No. of Functions: 2

Offers multiple functions within a single package, reducing the need for multiple components and simplifying the design.

Package Shape: SQUARE

Provides a compact and uniform shape, making it easy to handle and fit in tight spaces.

Power Supplies (V): 5

Operates at a standard power supply voltage, ensuring compatibility with most systems.

No. of Terminals: 20

Offers ample connectivity options for various interfacing requirements.

Package Style (Meter): CHIP CARRIER

Features a chip carrier style package, which is convenient for surface mounting and offers good thermal conductivity.

Minimum Supply Voltage: 4.5 V

Supports lower supply voltages, providing flexibility in voltage requirements for different applications.

Maximum Operating Temperature: 125 °C

Operates effectively at high temperatures, suitable for demanding industrial and military environments.

Output Characteristics: OPEN-COLLECTOR

Enables the device to sink current, making it suitable for driving external loads or interfacing with other components.

Minimum Operating Temperature: -55 °C

Capable of operating in extreme cold temperatures, making it suitable for harsh environments.

Terminal Position: QUAD

Arranged in a quad configuration, providing efficient routing and connectivity options.

Maximum Seated Height: 2.03 mm

Has a low profile design, allowing for compact and space-saving installations.

Width: 8.89 mm

Compact width size, ideal for applications with limited space.

Length: 8.89 mm

Compact length size, suitable for small form factor applications.

Temperature Grade: MILITARY

Meets stringent military standards for reliability and performance, making it suitable for mission-critical applications.

Maximum Output Current: 0.4 A

Capable of handling high output currents, suitable for driving power-hungry loads.

Technology: BIPOLAR

Utilizes bipolar technology for high-speed and efficient operation.

Terminal Form: NO LEAD

Lead-free terminal form, compliant with environmental regulations and suitable for RoHS requirements.

Input Characteristics: STANDARD

Follows standard input characteristics, ensuring compatibility with various control signals and systems.

Nominal Supply Voltage: 5 V

Operates at a standard nominal supply voltage, making it easy to interface with other components.

Turn-on Time: 0.035 us

Provides fast turn-on time, enabling quick response and high-speed switching capabilities.

Terminal Pitch: 1.27 mm

Standard terminal pitch for easy connectivity and compatibility with standard PCB layouts.

Driver No. of Bits: 2

Two bits of driver functionality, offering versatile control and output options.

Nominal Output Peak Current Limit: 0.5 A

Imposes a peak current limit to protect the device and connected components from excessive current.

Interface IC Type: NAND GATE BASED PERIPHERAL DRIVER

Uses NAND gate based interface for efficient control and signal processing in peripheral applications.

Turn-off Time: 0.035 us

Fast turn-off time for quick response and high-speed switching operations.

Output Current Flow Direction: SINK

Supports current sinking operation, suitable for driving external loads and interfacing with various devices.

Technical Specifications

Peripheral Drivers SN55452BFK attributes and parameters. Explore more Peripheral Drivers devices from Texas Instruments

Specs

Driver No. of Bits:

2

Input Characteristics:

STANDARD

JESD-30 Code:

S-CQCC-N20

Length:

8.89 mm

No. of Functions:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

OPEN-COLLECTOR

Output Current Flow Direction:

SINK

Maximum Output Current:

.4 A

Nominal Output Peak Current Limit:

.5 A

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

2.03 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Turn-off Time:

.035 us

Turn-on Time:

.035 us

Width:

8.89 mm

Trade Compliance

SN55452BFK Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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