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SN55454BFK

Texas Instruments

SN55454BFK by Texas Instruments

SN55454BFK by Texas Instruments is a NOR gate-based peripheral driver with 2 functions, operating at 5V. It features open-collector output, -55 to 125°C temperature range, and 0.4A max output current. Ideal for military-grade applications requiring fast turn-on/off times and sink current flow direction.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,147 parts In-Stock

1+ parts

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3,147

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Vyrian

USA . 2,139 parts In-Stock

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2,139

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,318 parts In-Stock

1+ parts

$9.094

100+ parts

-

1k+ parts

$9.749

10k+ parts

-

2,318

$9.094

-

$9.749

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DigiPath Technology Company

USA . 1,809 parts In-Stock

1+ parts

$10.014

100+ parts

$9.213

1k+ parts

-

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1,809

$10.014

$9.213

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ChromeModa Solutions

Germany . 3,512 parts In-Stock

1+ parts

$10.218

100+ parts

$8.379

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-

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3,512

$10.218

$8.379

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IDEA Electronic Components Group

UK . 513 parts In-Stock

1+ parts

$10.218

100+ parts

$9.707

1k+ parts

$9.196

10k+ parts

-

513

$10.218

$9.707

$9.196

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AZTECH Wire

Italy . 368 parts In-Stock

1+ parts

$12.551

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368

$12.551

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One Stop Electronics

USA . 1,408 parts In-Stock

1+ parts

$26.500

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1,408

$26.500

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Corphita

USA . 3,617 parts In-Stock

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3,617

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Overview

Enhance your electronic projects with the SN55454BFK by Texas Instruments, a premium quality peripheral driver designed to exceed your expectations. Manufactured by industry leader Texas Instruments, this versatile chip carrier offers reliability and efficiency in a compact square package. Ideal for a wide range of applications, this military-grade device ensures optimal performance even in extreme temperatures. With its open-collector output characteristics and superior technology, the SN55454BFK delivers fast turn-on/off times and high output current flow direction, making it a valuable asset for your projects. Elevate your designs with the trusted brand and exceptional features of Texas Instruments' SN55454BFK.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

Provides durability and protection for the internal components, ensuring long-lasting performance and reliability.

Maximum Supply Voltage: 5.5 V

Can handle high voltage inputs, making it suitable for a wide range of applications.

No. of Functions: 2

Offers multiple functions in a single device, saving space and cost in a circuit design.

Maximum Operating Temperature: 125 °C

Can operate in high temperature environments without compromising functionality.

Technology: BIPOLAR

Uses bipolar technology for improved performance and efficiency.

Interface IC Type: NOR GATE BASED PERIPHERAL DRIVER

Utilizes NOR gate based design for reliable and efficient operation in peripheral driver applications.

Technical Specifications

Peripheral Drivers SN55454BFK attributes and parameters. Explore more Peripheral Drivers devices from Texas Instruments

Specs

Driver No. of Bits:

2

Input Characteristics:

STANDARD

JESD-30 Code:

S-CQCC-N20

Length:

8.89 mm

No. of Functions:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

OPEN-COLLECTOR

Output Current Flow Direction:

SINK

Maximum Output Current:

.4 A

Nominal Output Peak Current Limit:

.5 A

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

2.03 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Turn-off Time:

.035 us

Turn-on Time:

.035 us

Width:

8.89 mm

Trade Compliance

SN55454BFK Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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