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SN55452BFK-00

Texas Instruments

SN55452BFK-00 by Texas Instruments

SN55452BFK-00 by Texas Instruments is a NAND gate-based peripheral driver with 2 functions, operating at 4.5-5.5V supply voltage range. It has a turn-on/off time of 0.035us and sink output current flow direction. Ideal for military-grade applications due to its MIL temperature grade and ceramic-metal package material.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,195 parts In-Stock

1+ parts

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3,195

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Digiode

USA . 646 parts In-Stock

1+ parts

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646

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,904 parts In-Stock

1+ parts

$4.269

100+ parts

-

1k+ parts

$4.700

10k+ parts

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1,904

$4.269

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$4.700

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DigiPath Technology Company

USA . 1,984 parts In-Stock

1+ parts

$4.701

100+ parts

-

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10k+ parts

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1,984

$4.701

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ChromeModa Solutions

Germany . 6,717 parts In-Stock

1+ parts

$4.797

100+ parts

$3.934

1k+ parts

-

10k+ parts

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6,717

$4.797

$3.934

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IDEA Electronic Components Group

UK . 845 parts In-Stock

1+ parts

$4.797

100+ parts

-

1k+ parts

$4.317

10k+ parts

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845

$4.797

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$4.317

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AZTECH Wire

Italy . 743 parts In-Stock

1+ parts

$5.319

100+ parts

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743

$5.319

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One Stop Electronics

USA . 1,318 parts In-Stock

1+ parts

$18.500

100+ parts

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1,318

$18.500

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Corphita

USA . 4,902 parts In-Stock

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4,902

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Overview

Unlock the power of precision with the SN55452BFK-00 by Texas Instruments. This top-of-the-line peripheral driver offers unparalleled quality and reliability, thanks to its advanced technology and military-grade construction. Perfect for a wide range of applications, this chip carrier package delivers swift turn-on and turn-off times, ensuring seamless performance every time. Trust Texas Instruments to provide you with the best in class products that deliver exceptional value and unmatched benefits to meet all your needs.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides durability and reliability, making the product suitable for various applications.

Surface Mount: YES

Ease of installation and space-saving design.

Maximum Supply Voltage: 5.5 V

Allows for compatibility with a wide range of systems.

No. of Functions: 2

Provides versatility and flexibility in functionality.

Package Shape: SQUARE

Optimal use of space and efficient design.

No. of Terminals: 20

Sufficient number of terminals for connections and interfaces.

Package Style (Meter): CHIP CARRIER

Compact size and efficient heat dissipation.

Minimum Supply Voltage: 4.5 V

Wide operating voltage range for compatibility with different power sources.

Maximum Operating Temperature: 125 °C

Suitable for high-temperature environments and applications.

Minimum Operating Temperature: -55 °C

Can withstand low-temperature conditions.

Terminal Position: QUAD

Facilitates easy and organized connections.

Maximum Seated Height: 2.03 mm

Low profile design for space-saving solutions.

Width: 8.89 mm

Compact size for efficient integration into systems.

Length: 8.89 mm

Optimal dimensions for various applications.

Temperature Grade: MILITARY

Meets high standards of reliability and durability.

Technology: BIPOLAR

Provides fast and reliable operation.

Terminal Form: NO LEAD

Lead-free design for environmental friendliness.

Nominal Supply Voltage: 5 V

Standard voltage for compatibility with many systems.

Turn-on Time: 0.035 us

Fast response time for efficiency.

Terminal Pitch: 1.27 mm

Optimal spacing for connections.

Nominal Output Peak Current Limit: 0.5 A

Sufficient current handling capacity for various applications.

Interface IC Type: NAND GATE BASED PERIPHERAL DRIVER

Advanced interface for versatile applications.

Turn-off Time: 0.035 us

Quick shutdown for responsive operation.

Output Current Flow Direction: SINK

Sink type output for efficient circuit design.

Technical Specifications

Peripheral Drivers SN55452BFK-00 attributes and parameters. Explore more Peripheral Drivers devices from Texas Instruments

Specs

JESD-30 Code:

S-CQCC-N20

Length:

8.89 mm

No. of Functions:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

.5 A

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

2.03 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Turn-off Time:

.035 us

Turn-on Time:

.035 us

Width:

8.89 mm

Trade Compliance

SN55452BFK-00 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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