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SN55188J

Texas Instruments

SN55188J by Texas Instruments

SN55188J by Texas Instruments is a LINE DRIVER with 4 functions, operating at -55 to 125 °C. It has a max supply voltage of +-15 V and a transmit delay of 350 ns. Ideal for EIA-232-E, TIA-232-E, and V.28 interfaces in military-grade applications.

Median Price

$11.171

Lifecycle Status

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28

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1k+

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Chip1Stop

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Vyrian

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PAR Electronics

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Corel Iberica Componentes, S.L.

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Parana Technologies

USA . 1,443 parts In-Stock

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DigiPath Technology Company

USA . 2,145 parts In-Stock

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ChromeModa Solutions

Germany . 6,611 parts In-Stock

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IDEA Electronic Components Group

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AZTECH Wire

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Overview

Enhance your electronic systems with the Texas Instruments SN55188J Line Driver & Receiver. Built with top-notch quality by a renowned manufacturer, this IC offers reliability and precision in various applications. With its advanced technology and military-grade temperature grade, this product ensures optimal performance even in challenging environments. Experience seamless communication and enhanced signal transmission with the SN55188J, providing unmatched value and benefits to customers looking for quality components for their projects.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The use of ceramic and glass-sealed materials ensures durability and protection for the internal components of the device, making it a reliable choice for long-term use.

Maximum Supply Voltage: 15 V

With a high maximum supply voltage of 15V, this product is suitable for applications requiring higher power input, providing flexibility and compatibility with various systems.

No. of Functions: 4

The multiple functions available in this product offer versatility and efficiency in managing different tasks within a circuit or system, making it a versatile and cost-effective option.

Maximum Transmit Delay: 350 ns

The low transmit delay of 350 ns ensures quick and efficient data transmission, making this product ideal for applications requiring fast response times and minimal latency.

Output Polarity: INVERTED

The inverted output polarity allows for compatibility with systems that require inverted signals, enhancing the adaptability and usability of this product in diverse environments.

Technical Specifications

Line Drivers & Receivers SN55188J attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

1 SINGLE INPUT DRIVER

Differential Output:

NO

Driver No. of Bits:

4

Maximum High Level Input Current:

.00001 Amp

Input Characteristics:

GATED

Interface IC Type:

Interface Standard:

EIA-232-E; TIA-232-E; V.28

JESD-30 Code:

R-GDIP-T14

JESD-609 Code:

e0

Length:

19.56 mm

Nominal Negative Supply Voltage:

-9 V

No. of Functions:

4

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Minimum Out Swing:

12 V

Output Characteristics:

TOTEM-POLE

Maximum Output Low Current:

.01 Amp

Output Polarity:

INVERTED

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

+-9

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Maximum Seated Height:

5.08 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

34 mA

Maximum Supply Voltage:

15 V

Minimum Supply Voltage:

7.5 V

Nominal Supply Voltage:

9 V

Maximum Supply Voltage-1:

15 V

Minimum Supply Voltage-1:

7.5 V

Nominal Supply Voltage-1:

9 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Transmit Delay:

350 ns

Width:

7.62 mm

Trade Compliance

SN55188J Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-313-6497, 5962013136497

NIIN

013136497

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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